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SIHG14N50D-GE3

Vishay Intertechnology

SIHG14N50D-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIHG14N50D-GE3 is a N-channel power FET with 500V DS breakdown voltage and 38A max pulsed drain current. Ideal for switching applications, it features a built-in diode, 0.4 ohm max RDS(on), and 56mJ EAS rating.

Median Price

$3.285

Lifecycle Status

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DigiKey

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$1.508

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Mouser Electronics

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$3.160

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$2.150

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$1.530

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Farnell

UK . 450 parts In-Stock

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$3.410

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$1.660

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450

$3.410

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Element14

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$3.443

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$2.214

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$1.669

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627

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

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Dan-Mar Components

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Bristol Electronics

USA . 875 parts In-Stock

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$1.568

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$1.378

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875

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Argo Parts USA

USA . 5,000 parts In-Stock

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$1.735

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5,000

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Ampacity Inc.

Singapore . 407 parts In-Stock

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$1.890

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Continental Prestige Electronics

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Microchip USA

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Overview

Elevate your power management solutions with the SIHG14N50D-GE3 by Vishay Intertechnology, a leading manufacturer in the industry. This N-channel Power FET offers reliable performance in switching applications, with a minimum DS Breakdown Voltage of 500V and maximum Drain Current of 14A. With enhanced energy efficiency and durability, this transistor is ideal for a wide range of industrial and automotive applications. Upgrade your systems today and experience the value and benefits that only Vishay Intertechnology can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, ensuring the long-term performance and reliability of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and better performance compared to P-channel FETs, making them a more efficient choice for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from reverse voltage spikes, improving the overall reliability and safety of the FET in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, making it ideal for power management and control in a variety of electronic devices.

Minimum DS Breakdown Voltage: 500 V

With a high minimum breakdown voltage of 500 V, this FET can handle high voltage levels, making it suitable for applications requiring robust and reliable performance in demanding conditions.

Maximum Pulsed Drain Current (IDM): 38 A

The high maximum pulsed drain current of 38 A allows this FET to handle peak current demands without overheating or risking damage, ensuring stable operation under varying load conditions.

Avalanche Energy Rating (EAS): 56 mJ

The high avalanche energy rating of 56 mJ indicates the FET's ability to withstand short-duration high-energy pulses, making it suitable for applications where transient voltage spikes may occur.

Maximum Drain Current (ID): 14 A

With a maximum drain current of 14 A, this FET can efficiently handle continuous current flow without overheating, ensuring reliable performance in power management applications.

Maximum Drain-Source On Resistance: 0.4 ohm

The low on-resistance of 0.4 ohm reduces power loss and heat generation in the FET, improving overall efficiency and performance in high-power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) SIHG14N50D-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

56 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

38 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIHG14N50D-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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