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SIDR610DP-T1-GE3

Vishay Intertechnology

SIDR610DP-T1-GE3 by Vishay Intertechnology

SIDR610DP-T1-GE3 by Vishay Intertechnology is a N-channel power FET with a min DS breakdown voltage of 200V. It is used for switching applications and has a max pulsed drain current of 80A.

Median Price

$3.330

Lifecycle Status

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11

In-Stock Inventory

1k+

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Mouser Electronics

USA . 11,397 parts In-Stock

1+ parts

$4.350

100+ parts

$2.240

1k+ parts

$2.160

10k+ parts

$1.840

11,397

$4.350

$2.240

$2.160

$1.840

Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

-

100+ parts

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$3.330

6,000

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$3.330

Farnell

UK . 5,681 parts In-Stock

1+ parts

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100+ parts

$1.720

1k+ parts

$1.410

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5,681

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$1.720

$1.410

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Verical

USA . 1,815 parts In-Stock

1+ parts

-

100+ parts

$2.110

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$1.950

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1,815

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$2.110

$1.950

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Element14

Singapore . 1,715 parts In-Stock

1+ parts

-

100+ parts

$3.630

1k+ parts

$3.150

10k+ parts

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1,715

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$3.630

$3.150

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Nova Conductors

Japan . 15 parts In-Stock

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$2.150

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15

$2.150

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NAC Semi

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$2.580

6,000

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$2.580

IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

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100+ parts

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$5.273

6,000

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$5.273

Bristol Electronics

USA . 4,727 parts In-Stock

1+ parts

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100+ parts

$1.232

1k+ parts

$1.010

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4,727

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$1.232

$1.010

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Dan-Mar Components

USA . 1,727 parts In-Stock

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1,727

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Vyrian

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1,255

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Aztec Data Supply Inc.

USA . 576 parts In-Stock

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$0.660

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576

$0.660

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Corohmni

South Africa . 69 parts In-Stock

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69

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Semicontronic

India . 2,292 parts In-Stock

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$1.790

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$1.745

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$1.736

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2,292

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$1.745

$1.736

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Ampacity Inc.

Singapore . 2,190 parts In-Stock

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$1.790

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2,190

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Argo Parts USA

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$2.150

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3,255

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Netroflash

USA . 500 parts In-Stock

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$2.150

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$2.107

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500

$2.150

$2.107

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Continental Prestige Electronics

USA . 6,126 parts In-Stock

1+ parts

$2.710

100+ parts

$1.640

1k+ parts

$1.250

10k+ parts

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6,126

$2.710

$1.640

$1.250

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Overview

Discover the power of the SIDR610DP-T1-GE3 by Vishay Intertechnology! This high-quality Power Field Effect Transistor is a game-changer in the switching applications category. With its N-CHANNEL configuration and built-in diode, it provides unmatched performance and reliability. The small outline package and no-lead terminal form make it easy to integrate into any project. Boasting a maximum pulsed drain current of 80 A and a maximum power dissipation of 125 W, this transistor delivers exceptional results. Whether you're designing for automotive, industrial, or consumer electronics, the SIDR610DP-T1-GE3 offers the value, benefits, and advantages you need to take your products to the next level. Trust Vishay Intertechnology, a leading manufacturer known for their excellence in semiconductor technology, to provide you with the best solution for your needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the internal components, making it suitable for various operating conditions.

Polarity or Channel Type:

N-CHANNEL - This type of polarity provides efficient and reliable switching capabilities, making it suitable for a wide range of applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and protects against reverse voltage, enhancing the overall performance and functionality of the product.

Transistor Application:

SWITCHING - Designed specifically for switching applications, this product offers fast and reliable switching speeds, ensuring efficient power management.

Surface Mount:

YES - The surface mount capability enables easy and convenient installation on circuit boards, saving space and enhancing overall system efficiency.

Minimum DS Breakdown Voltage:

200 V - With a high breakdown voltage, this product can handle higher power levels and voltages, making it suitable for demanding applications.

Package Shape:

RECTANGULAR - The rectangular package shape allows for efficient utilization of available space on circuit boards, maximizing overall system integration and design flexibility.

Terminal Form:

NO LEAD - The no lead terminal form reduces the risk of solder joint failures and improves thermal performance, enhancing the overall reliability of the product.

Operating Mode:

ENHANCEMENT MODE - The enhancement mode operation offers improved control over the transistor's behavior, resulting in better power efficiency and performance.

No. of Elements:

1 - With a single element, this product offers simplicity and ease of use, making it ideal for various applications that require a basic transistor setup.

Maximum Pulsed Drain Current (IDM):

80 A - With a high maximum pulsed drain current, this product can handle high-power pulses, making it suitable for applications with periodic high current demands.

Avalanche Energy Rating (EAS):

45 mJ - The high avalanche energy rating ensures robustness and protection against voltage spikes, making it suitable for demanding applications with voltage surges.

No. of Terminals:

8 - Having 8 terminals allows for flexible connections and easy incorporation into existing circuit designs, making it suitable for complex applications.

Maximum Power Dissipation (Abs):

125 W - With a high maximum power dissipation, this product can handle higher power levels without overheating, ensuring reliable and continuous operation.

Package Style (Meter):

SMALL OUTLINE - The small outline package style offers compactness and space-saving benefits, making it ideal for applications with limited physical space.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - This technology provides high efficiency and low power consumption, making it an ideal choice for applications that require energy-saving features.

Maximum Operating Temperature:

150 °C - With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable operation.

Transistor Element Material:

SILICON - The use of silicon as the transistor element material ensures high performance, reliability, and compatibility with various applications.

Maximum Turn On Time (ton):

76 ns - The fast turn-on time enables quick response and efficient power control, making it suitable for applications that require rapid switching.

Minimum Operating Temperature:

55 °C - With a low minimum operating temperature, this product can operate reliably even in extremely cold environments, expanding its range of applications.

Maximum Turn Off Time (toff):

84 ns - The fast turn-off time ensures efficient power control and reduces switching losses, improving overall system performance.

Terminal Finish:

TIN - The tin terminal finish offers excellent solderability and corrosion resistance, ensuring reliable electrical connections over an extended period.

Maximum Drain Current (ID):

39.6 A - With a high maximum drain current, this product can handle high current loads effectively, making it suitable for demanding applications.

Maximum Drain-Source On Resistance:

0.0334 ohm - The low drain-source on resistance minimizes power losses and improves overall system efficiency, making it an excellent choice for power applications.

Terminal Position:

DUAL - The dual terminal position allows for versatile and flexible connections, making it suitable for applications with specific wiring requirements.

Moisture Sensitivity Level (MSL):

1 - With a moisture sensitivity level of 1, this product can withstand moisture exposure during assembly and operation, ensuring long-term reliability.

Case Connection:

DRAIN - The drain case connection offers efficient heat dissipation and ensures reliable thermal management, enhancing the overall lifespan and performance of the product.

Peak Reflow Temperature °C:

260 - With a high peak reflow temperature, this product can withstand high-temperature soldering processes, ensuring proper and reliable assembly.

Maximum Feedback Capacitance (Crss):

11 pF - The low feedback capacitance minimizes unwanted oscillations and provides excellent stability, making it suitable for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) SIDR610DP-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

45 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

39.6 A

Maximum Drain-Source On Resistance:

.0334 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

84 ns

Maximum Turn On Time (ton):

76 ns

Trade Compliance

SIDR610DP-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

Category top products 20

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