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SI9945AEY

Vishay Intertechnology

SI9945AEY by Vishay Intertechnology

Vishay Intertechnology's SI9945AEY is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.08 ohm RDS(ON). It features 25A IDM, suitable for power applications. The PLASTIC/EPOXY package with GULL WING terminals makes it ideal for surface mount designs.

Median Price

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Right Parts Inc.

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Odintec Ltd.

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

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AZTECH Wire

Italy . 379 parts In-Stock

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Overview

Unlock the power of innovation with the Vishay Intertechnology SI9945AEY Power Field Effect Transistor. Designed with superior quality and cutting-edge technology, this N-CHANNEL FET boasts a dual-element configuration with a built-in diode, perfect for a wide range of applications. Whether you're looking to enhance your circuit performance or optimize power management, this transistor delivers unrivaled reliability and efficiency. Upgrade your designs today with the Vishay Intertechnology SI9945AEY and experience the difference in performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the FET suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in electronic circuits.

Surface Mount: YES

Facilitates easy assembly onto circuit boards, saving time and effort during production.

Minimum DS Breakdown Voltage: 60 V

Ensures reliable performance and protection against high voltages in the circuit.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Provides flexibility in circuit design and functionality with built-in diode for reverse current protection.

Maximum Pulsed Drain Current (IDM): 25 A

Allows for handling high current spikes and power surges without damage to the FET.

Maximum Drain Current (ID): 3.7 A

Suitable for applications requiring moderate current handling capabilities.

Maximum Drain-Source On Resistance: 0.08 ohm

Provides low resistance for efficient power transfer and reduced heat generation.

Technical Specifications

Power Field Effect Transistors (FET) SI9945AEY attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

3.7 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

25 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

SI9945AEY Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-476-9766, 5961014769766

NIIN

014769766

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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