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MSP08A0122K0FDA

Vishay Intertechnology

MSP08A0122K0FDA by Vishay Intertechnology

Vishay Intertechnology's MSP08A0122K0FDA is a 7-element resistor array with 22000 ohm resistance, 1% tolerance, and 0.3 W power dissipation. Ideal for through-hole mounting applications in electronic circuits requiring precise resistance values at temperatures ranging from -55 to 150 °C.

Median Price

$5.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 84 parts In-Stock

1+ parts

$5.600

100+ parts

$2.614

1k+ parts

-

10k+ parts

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84

$5.600

$2.614

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Vyrian

USA . 575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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575

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Nova Conductors

Japan . 80 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 485 parts In-Stock

1+ parts

$12.965

100+ parts

-

1k+ parts

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10k+ parts

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485

$12.965

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

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Overview

Vishay / Dale MSP Single-In-Line Thick Film Resistor Networks feature a maximum seated height of 0.195" (4.95mm) for the "A" version and 0.350" (8.89mm) for the "C" version. These resistor networks have a rugged, molded case construction and are designed to help reduce total assembly costs. Additional features include thick film resistive elements, a wide 10Ω to 2.2MΩ resistance range, and a low ±100ppm/°C temperature coefficient from -55°C to +125°C. Vishay / Dale MSP Single-In-Line Thick Film Resistor Networks are available in a tube pack and compatible with automatic insertion equipment while reducing PC board space. Isolated, bused, and dual terminator schematics are available.

Feature Benefit Bullets

Spacing (Lead): 2.54 mm

The spacing between leads allows for easy and convenient installation on a circuit board.

Element Power Dissipation: 0.3 W

With a power dissipation of 0.3 W, this product can handle moderate power loads effectively.

Rated Temperature: 25 °C

The rated temperature of 25°C ensures stable performance under normal operating conditions.

Technology: METAL GLAZE/THICK FILM

The use of metal glaze/thick film technology provides high precision and reliability in resistance values.

No. of Elements: 7

Having 7 elements allows for more flexible electrical configurations in the circuit.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this product can withstand higher temperature environments without compromising performance.

Technical Specifications

Resistor Networks & Arrays MSP08A0122K0FDA attributes and parameters. Explore more Resistor Networks & Arrays devices from Vishay Intertechnology

Specs

Construction:

Molded Case

Element Power Dissipation:

.3 W

First Element Resistance:

22000 ohm

JESD-609 Code:

e0

Length (Lead):

3.43 mm

Spacing (Lead):

2.54 mm

Mounting Type:

Network Type:

BUSSED

No. of Elements:

7

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

4.95 mm

Length (Package):

20.07 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SIP

Width (Package):

2.29 mm

Packing Method:

TUBE

Rated Power Dissipation (P):

Rated Temperature:

25 Cel

Resistance:

Resistor Type:

Size Code:

7909

Sub-Category:

ARRAY/NETWORK RESISTOR

Technology:

METAL GLAZE/THICK FILM

Temperature Coef (ppm/Cel):

100

Temperature Coef Tracking:

50 ppm/Cel

Terminal Finish:

TIN LEAD

Terminal Shape:

FLAT

Tolerance:

1 %

Operating Voltage:

100 V

Trade Compliance

MSP08A0122K0FDA Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.50

SB

8533.21.00.75

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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