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MSP09A0122K0GDA

Vishay Intertechnology

MSP09A0122K0GDA by Vishay Intertechnology

Vishay Intertechnology's MSP09A0122K0GDA resistor network features 8 elements with 22000 ohm resistance, 2% tolerance, and 0.2 W power dissipation. Ideal for applications requiring precise resistance values in a compact SIP package with through-hole mounting.

Median Price

$4.093

Lifecycle Status

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Nova Conductors

Japan . 86 parts In-Stock

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Vyrian

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Netroflash

USA . 2,000 parts In-Stock

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$3.888

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$3.806

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AZTECH Wire

Italy . 710 parts In-Stock

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Overview

Vishay / Dale MSP Single-In-Line Thick Film Resistor Networks feature a maximum seated height of 0.195" (4.95mm) for the "A" version and 0.350" (8.89mm) for the "C" version. These resistor networks have a rugged, molded case construction and are designed to help reduce total assembly costs. Additional features include thick film resistive elements, a wide 10Ω to 2.2MΩ resistance range, and a low ±100ppm/°C temperature coefficient from -55°C to +125°C. Vishay / Dale MSP Single-In-Line Thick Film Resistor Networks are available in a tube pack and compatible with automatic insertion equipment while reducing PC board space. Isolated, bused, and dual terminator schematics are available.

Feature Benefit Bullets

Spacing (Lead): 2.54 mm

The 2.54 mm spacing between leads allows for easy installation and connection in standard PCB layouts.

Element Power Dissipation: 0.2 W

With a power dissipation of 0.2 W, this resistor network can handle moderate power levels effectively.

Rated Temperature: 70 °C

Suitable for operation within a temperature range of 70°C, ensuring reliability in most operating environments.

Technology: METAL GLAZE/THICK FILM

The use of metal glaze/thick film technology enhances the durability and stability of the resistors, making them long-lasting.

Shape (Package): RECTANGULAR PACKAGE

The rectangular package design provides a space-efficient and organized layout for the resistors on the PCB.

No. of Elements: 8

With 8 elements in the network, this resistor array offers a high level of resistance options for different circuit requirements.

Packing Method: TUBE

The tube packing method ensures safe transportation and storage of the resistor network, preventing damage during handling.

Resistance: 22000 ohm

With a resistance of 22000 ohms, this resistor array provides precise and stable resistance values for accurate circuit operation.

Temperature Coef Tracking: 50 ppm/°C

The tracking temperature coefficient of 50 ppm/C ensures minimal resistance variation with temperature changes, maintaining circuit performance.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish offers excellent solderability and conductivity, ensuring secure and reliable connections on the PCB.

Technical Specifications

Resistor Networks & Arrays MSP09A0122K0GDA attributes and parameters. Explore more Resistor Networks & Arrays devices from Vishay Intertechnology

Specs

Construction:

Molded Case

Element Power Dissipation:

.2 W

First Element Resistance:

22000 ohm

JESD-609 Code:

e0

Length (Lead):

3.43 mm

Spacing (Lead):

2.54 mm

Mounting Type:

Network Type:

BUSSED

No. of Elements:

8

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

4.95 mm

Length (Package):

22.61 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SIP

Width (Package):

2.29 mm

Packing Method:

TUBE

Rated Power Dissipation (P):

Rated Temperature:

70 Cel

Resistance:

Resistor Type:

Series:

MSP-NETWORK

Size Code:

8909

Sub-Category:

ARRAY/NETWORK RESISTOR

Technology:

METAL GLAZE/THICK FILM

Temperature Coef (ppm/Cel):

100

Temperature Coef Tracking:

50 ppm/Cel

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Shape:

FLAT

Tolerance:

2 %

Operating Voltage:

100 V

Trade Compliance

MSP09A0122K0GDA Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.50

SB

8533.21.00.75

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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