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NOMCT16031001ATF

Vishay Intertechnology

NOMCT16031001ATF by Vishay Intertechnology

Vishay Intertechnology's NOMCT16031001ATF resistor network features 1000 ohm resistance, 1.27 mm lead spacing, and 0.1 W power dissipation. Ideal for applications requiring a rugged, isolated thin film network with precise temperature tracking capabilities in SMT package style.

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Vyrian

USA . 588 parts In-Stock

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Nova Conductors

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Aztec Data Supply Inc.

USA . 590 parts In-Stock

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$0.240

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590

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Corohmni

South Africa . 858 parts In-Stock

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858

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AZTECH Wire

Italy . 272 parts In-Stock

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$19.484

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Upgrade your electronics with the Vishay Intertechnology NOMCT16031001ATF Resistor Network, offering unparalleled quality and reliability. Designed with a rugged construction and thin film technology, this isolated resistor array provides precise resistance and temperature stability for a wide range of applications. With a tolerance of 0.1% and 1000 ohm resistance, this component guarantees optimal performance in demanding environments. Trust Vishay Intertechnology for superior products that deliver lasting value and exceptional results.

Feature Benefit Bullets

Spacing (Lead) 1.27 mm

Close spacing leads to efficient use of PCB space and ensures a compact design.

Element Power Dissipation 0.1 W

Higher power dissipation capacity allows the resistor network to handle more power without overheating, ensuring reliability.

Rated Temperature 70 °C

Suitable for operation within a wide temperature range, making it versatile for various environments.

No. of Functions 8

With multiple functions in a single component, it simplifies circuit design and saves space on the PCB.

Technology THIN FILM

Thin film technology provides high precision and stability in resistor values, resulting in accurate circuit performance.

Construction Rugged

Rugged construction ensures durability and reliability in demanding operating conditions.

Packing Method TR

Tape and reel packaging simplifies automated assembly processes, improving efficiency.

Network Type ISOLATED

Isolated design prevents interaction between resistors, ensuring independent functionality and accuracy.

Resistance 1000 ohm

Standard resistance value suitable for a wide range of applications.

No. of Terminals 16

Multiple terminals provide flexibility in circuit connections and configurations.

Temperature Coef Tracking 5 ppm/°C

Low temperature coefficient ensures minimal resistance changes with temperature fluctuations, maintaining circuit accuracy.

Package Style (Meter) SMT

Surface mount package style saves space on the PCB and enables automated assembly.

Terminal Shape GULL WING

Gull wing terminals provide secure solder connections and ease of assembly.

Maximum Operating Temperature 125 °C

Wide operating temperature range allows for use in high-temperature environments.

First Element Resistance 1000 ohm

Consistent resistance values across elements ensure balanced performance in the network.

Minimum Operating Temperature -55 °C

Suitable for operation in low-temperature environments without performance degradation.

Temperature Coef (ppm/°C) 25

Low temperature coefficient ensures stable resistance values over varying temperature conditions.

Terminal Finish Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

Height (Package) 1.6 mm

Low-profile package design saves space and allows for compact circuitry.

Resistor Type ARRAY/NETWORK RESISTOR

Array/network resistor combines multiple resistors in one package, simplifying circuit layout and design.

Operating Voltage 100 V

Rated for a high operating voltage, suitable for a wide range of applications.

Tolerance 0.1 %

High precision tolerance ensures accurate resistance values for precise circuit performance.

Length (Package) 9.906 mm

Compact package length saves space on the PCB and enables efficient layout.

Mounting Type SURFACE MOUNT

Surface mounting type allows for easy and secure installation on the PCB.

Rated Power Dissipation (P) 0.1 W

Suitable power dissipation rating ensures reliable performance under various load conditions.

Width (Package) 3.91 mm

Narrow package width saves space on the PCB and allows for efficient design layouts.

Technical Specifications

Resistor Networks & Arrays NOMCT16031001ATF attributes and parameters. Explore more Resistor Networks & Arrays devices from Vishay Intertechnology

Specs

Construction:

Rugged

Element Power Dissipation:

.1 W

First Element Resistance:

1000 ohm

JESD-609 Code:

e3

Spacing (Lead):

1.27 mm

Mounting Type:

Network Type:

ISOLATED

No. of Elements:

1

No. of Functions:

8

No. of Terminals:

16

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

1.6 mm

Length (Package):

9.906 mm

Package Style (Meter):

SMT

Width (Package):

3.91 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

70 Cel

Resistance:

Resistor Type:

Size Code:

3915

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Temperature Coef Tracking:

5 ppm/Cel

Terminal Finish:

Matte Tin (Sn)

Terminal Shape:

GULL WING

Tolerance:

Operating Voltage:

100 V

Trade Compliance

NOMCT16031001ATF Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.10

SB

8533.21.00.25

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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