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TH58NYG3S0HBAI4

Toshiba

TH58NYG3S0HBAI4 by Toshiba

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;

Median Price

$9.120

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 210 parts In-Stock

1+ parts

$9.120

100+ parts

$8.083

1k+ parts

$7.316

10k+ parts

$7.178

210

$9.120

$8.083

$7.316

$7.178

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$9.120

100+ parts

$8.080

1k+ parts

$7.280

10k+ parts

$7.140

200

$9.120

$8.080

$7.280

$7.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 3,150 parts In-Stock

1+ parts

$7.574

100+ parts

$4.544

1k+ parts

$4.355

10k+ parts

-

3,150

$7.574

$4.544

$4.355

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Dan-Mar Components

USA . 4,784 parts In-Stock

1+ parts

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4,784

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ACDS - Activité Composants Distribution Service

France . 3,150 parts In-Stock

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3,150

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Rebound Electronics

UK . 210 parts In-Stock

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210

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Sensible Micro Corp

USA . 46 parts In-Stock

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46

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

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QUARKTWIN TECHNOLOGY LTD

USA . 28,377 parts In-Stock

1+ parts

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28,377

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 510 parts In-Stock

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510

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Metaverse IC Inc.

Canada . 156 parts In-Stock

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156

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ChipstoGo Electronic ltd

UK . 39 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Technical Specifications

EEPROM TH58NYG3S0HBAI4 attributes and parameters. Explore more EEPROM devices from Toshiba

Specs

JESD-30 Code:

R-PBGA-B63

Length:

11 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

63

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Trade Compliance

TH58NYG3S0HBAI4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Toshiba

TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.

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