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TC358867XBG(EL)

Toshiba

TC358867XBG(EL) by Toshiba

Toshiba's TC358867XBG(EL) is a 80-terminal consumer IC with CMOS technology. It operates b/w -20 to 85°C, with supply voltage ranging from 1.14V to 1.26V. The package style is grid array, very thin profile, fine pitch, making it suitable for various consumer circuit applications.

Median Price

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3

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< 1k

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Nova Conductors

Japan . 79 parts In-Stock

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79

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Bristol Electronics

USA . 41 parts In-Stock

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41

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Atlantic Semiconductor

USA . 41 parts In-Stock

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41

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Ampacity Inc.

Singapore . 348 parts In-Stock

1+ parts

$21.800

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348

$21.800

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 3,179 parts In-Stock

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Continental Prestige Electronics

USA . 2,503 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the cutting-edge TC358867XBG(EL) by Toshiba, a top-quality consumer IC that promises unparalleled performance and reliability. With Toshiba's renowned reputation for excellence in manufacturing, this product guarantees superior functionality and durability. Ideal for a wide range of applications, this IC offers unmatched value and benefits to customers, making it a must-have for any electronics project. Experience the advantage of Toshiba's expertise with the TC358867XBG(EL) today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides high durability and protects the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes it easier to integrate this IC into various electronic devices, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape allows for efficient use of space on PCBs, enabling compact designs for electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is suitable for a wide range of consumer electronic products, making it a versatile choice.

No. of Terminals: 80

With 80 terminals, this IC provides multiple connection options, allowing for complex circuit configurations and versatile functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch offers high packaging density, making it ideal for compact electronic devices with limited space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand temperature variations, ensuring reliability in various operating conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C allows this IC to function effectively in cold environments, providing versatile usage options.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB, simplifying the assembly process for electronic devices.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this IC can be integrated into slim electronic devices without adding bulk, ensuring a sleek design.

Width: 7 mm

The compact width of 7 mm enables space-efficient placement of this IC on the PCB, saving valuable board space for other components.

Minimum Supply Voltage (Vsup): 1.14 V

The low minimum supply voltage requirement of 1.14 V allows for efficient power consumption, making this IC suitable for battery-operated devices.

Length: 7 mm

The short length of 7 mm contributes to a compact form factor, enabling the integration of this IC into small electronic devices without sacrificing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the IC in consumer electronic applications.

Terminal Form: BALL

The ball terminal form provides a reliable connection and facilitates efficient soldering, ensuring stable electrical connections for optimal performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm allows for dense packaging of terminals, enabling high connectivity and functionality in a compact IC design.

Maximum Supply Voltage (Vsup): 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation of the IC within the specified voltage range, protecting the internal components from damage.

Technical Specifications

Other Function Consumer ICs TC358867XBG(EL) attributes and parameters. Explore more Other Function Consumer ICs devices from Toshiba

Specs

Additional Features:

1.8V NOMINAL DIGITAL SUPPLY ALSO AVAILABLE

General IC Type:

JESD-30 Code:

S-PBGA-B80

Length:

7 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TC358867XBG(EL) General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Toshiba

TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.

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