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XDAC34SH84IZAY

Texas Instruments

XDAC34SH84IZAY by Texas Instruments

XDAC34SH84IZAY by Texas Instruments is a 16-bit D/A converter with a max analog output voltage of 0.6V and min of -0.5V. It operates in industrial temperature range (-40 to 85°C) and has a nominal settling time of 0.01us, making it suitable for precision applications requiring fast response times. The package style is grid array, low profile, fine pitch with 196 terminals in a square shape, ideal for space-constrained designs that require high performance digital-to-analog conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,502 parts In-Stock

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6,502

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Digiode

USA . 3,092 parts In-Stock

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3,092

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Distributors (Availability)

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AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$10.653

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514

$10.653

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Parana Technologies

USA . 2,164 parts In-Stock

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$14.396

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$14.837

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2,164

$14.396

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$14.837

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DigiPath Technology Company

USA . 1,743 parts In-Stock

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$15.852

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1,743

$15.852

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ChromeModa Solutions

Germany . 4,405 parts In-Stock

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$16.175

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$13.264

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4,405

$16.175

$13.264

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IDEA Electronic Components Group

UK . 140 parts In-Stock

1+ parts

$16.175

100+ parts

$15.366

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$14.558

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140

$16.175

$15.366

$14.558

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One Stop Electronics

USA . 1,109 parts In-Stock

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$24.000

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$24.000

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Corphita

USA . 1,877 parts In-Stock

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1,877

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Overview

Experience unparalleled precision and reliability with the XDAC34SH84IZAY by Texas Instruments, a leader in cutting-edge technology. This Digital-to-Analog Converter delivers exceptional performance in a compact, versatile package, making it ideal for a wide range of applications. From industrial automation to telecommunications, this innovative product offers unmatched value and benefits, providing customers with seamless integration and high-quality output. Trust Texas Instruments to deliver excellence in every detail, setting new standards in the industry.

Feature Benefit Bullets

Maximum Analog Output Voltage: 0.6 V

Higher maximum analog output voltage allows for more precise and accurate analog signal generation.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the internal components of the converter.

Surface Mount: YES

Surface mount capability makes installation and integration of the converter into a circuit board easy and efficient.

No. of Bits: 16

16 bits of resolution provide high precision and accuracy in converting digital signals to analog output.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the converter can operate reliably in a wide range of temperature conditions.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V is commonly used in industrial applications and ensures compatibility with other components.

Technical Specifications

Digital-to-Analog Converters XDAC34SH84IZAY attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Parallel, Word

Input Bit Code:

Binary

Nominal Settling Time (tstl):

10 ns

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

.6 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

196

Terminal Form:

Terminal Position:

Bottom

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.472 in (12 mm)

Length:

0.472 in (12 mm)

Maximum Seated Height:

0.055 in (1.4 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B196

Trade Compliance

XDAC34SH84IZAY Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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