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X5LS20216ASPGEQQ1

Texas Instruments

X5LS20216ASPGEQQ1 by Texas Instruments

X5LS20216ASPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width and 163840 bytes of RAM. Ideal for automotive applications, it operates b/w -40 to 125 °C with a max clock frequency of 20 MHz. This Cortex-R4F CPU family device features ADC and DMA channels, suitable for high-speed data processing in automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,284 parts In-Stock

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Digiode

USA . 290 parts In-Stock

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290

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Distributors (Availability)

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AZTECH Wire

Italy . 343 parts In-Stock

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$8.245

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343

$8.245

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One Stop Electronics

USA . 407 parts In-Stock

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$31.000

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Parana Technologies

USA . 2,326 parts In-Stock

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$70.011

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ChromeModa Solutions

Germany . 3,888 parts In-Stock

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$78.664

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$64.504

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IDEA Electronic Components Group

UK . 2,084 parts In-Stock

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$78.664

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$74.731

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$70.798

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2,084

$78.664

$74.731

$70.798

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Corphita

USA . 3,433 parts In-Stock

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DigiPath Technology Company

USA . 1,721 parts In-Stock

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$70.923

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Overview

Discover the X5LS20216ASPGEQQ1 by Texas Instruments, a cutting-edge microcontroller designed to elevate your automotive applications. With its high-quality manufacturing from Texas Instruments and AEC-Q100 screening level, this microcontroller offers unparalleled reliability and performance. Whether you're looking to optimize your vehicle's efficiency or enhance its safety features, this product's robust capabilities, including 32-bit processing power and extensive memory capacity, will undoubtedly exceed your expectations. Embrace the future of automotive technology with the X5LS20216ASPGEQQ1.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage 1.65 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, leading to energy efficiency.

Address Bus Width 22

Wide address bus allows for efficient data transfer and processing, enhancing the overall performance of the microcontroller.

Screening Level AEC-Q100

AEC-Q100 screening ensures reliability and quality compliance for automotive applications, making it a suitable choice for automotive electronics.

Package Shape SQUARE

Square package shape provides uniformity and ease of integration into various electronic systems, optimizing space utilization.

Bit Size 32

32-bit architecture enables faster data processing and higher computational capabilities, making it suitable for complex applications.

Power Supplies (V) 1.5,3.3

Flexibility in power supply options allows for versatile applications and compatibility with different power sources.

No. of Terminals 144

Higher number of terminals offer more connectivity options and expandability for interfacing with external devices and peripherals.

Package Style (Meter) FLATPACK

Flatpack package style offers low profile design and efficient heat dissipation, suitable for space-constrained applications.

Minimum Supply Voltage 1.35 V

Low minimum supply voltage ensures stable operation even at low power levels, enhancing energy efficiency and reliability.

Maximum Operating Temperature 125 °C

High maximum operating temperature range allows for reliable performance in harsh environments, such as automotive and industrial applications.

CPU Family CORTEX-R4F

Cortex-R4F CPU family offers high-performance processing capabilities and efficient real-time control, suitable for demanding applications.

Minimum Operating Temperature -40 °C

Wide temperature range enables operation in extreme cold conditions, making it suitable for outdoor and automotive applications.

ADC Channels YES

Integrated ADC channels enable analog-to-digital conversion for sensor interfacing and data acquisition, enhancing the microcontroller's functionality.

DMA Channels YES

DMA channels support efficient data transfer and offload CPU processing, improving overall system performance and responsiveness.

Terminal Position QUAD

Quad terminal position offers secure and stable connectivity, ensuring reliable data transmission and signal integrity.

ROM Words 2097152

Large ROM capacity allows for storing a significant amount of program data and code, supporting complex software requirements.

Maximum Seated Height 1.6 mm

Low seated height facilitates compact design and space-saving integration, ideal for small form factor applications.

Width 20 mm

Compact width dimension enables easy PCB layout and integration into space-constrained designs, optimizing board space usage.

External Data Bus Width 16

Wide external data bus width enhances data transfer speed and efficiency, supporting high-speed communication with external peripherals.

Maximum Clock Frequency 20 MHz

High maximum clock frequency allows for fast processing and real-time operation, meeting the performance demands of modern applications.

Length 20 mm

Compact length dimension ensures space-efficient placement on PCBs, enabling versatile design options and space optimization.

Temperature Grade AUTOMOTIVE

Automotive temperature grade ensures reliable performance in extreme temperature fluctuations, making it ideal for automotive applications.

Peripheral IC Type MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and low power consumption, enhancing the microcontroller's processing capabilities.

RAM Bytes 163840

Large RAM capacity provides ample memory for data storage and processing, supporting multitasking and complex algorithms.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form GULL WING

Gull wing terminal form allows for easy soldering and secure connections, ensuring reliable electrical contact and signal integrity.

Maximum Supply Current 500 mA

High maximum supply current capability supports power-hungry peripherals and external devices, accommodating diverse application requirements.

Nominal Supply Voltage 1.5 V

Stable nominal supply voltage ensures consistent operation and reliable performance, meeting the power requirements of the microcontroller.

ROM Programmability FLASH

Flash ROM programmability offers flexibility for firmware updates and customization, supporting evolving application needs and functionality.

Terminal Pitch 0.5 mm

Fine terminal pitch allows for high-density integration and miniaturization, enabling compact and space-saving PCB layouts.

Speed 140 rpm

High speed capability supports fast data processing and response times, meeting the performance demands of real-time applications.

No. of I/O Lines 115

Abundant I/O lines provide ample interfacing options for connecting various external devices and peripherals, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers X5LS20216ASPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Bytes:

163840

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

140 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

X5LS20216ASPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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