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VSP5324RGCT

Texas Instruments

VSP5324RGCT by Texas Instruments

VSP5324RGCT by Texas Instruments is a 12-bit ADC with 4 analog in channels, operating at a sample rate of 65 MHz. It comes in a square chip carrier package with nickel palladium gold finish, suitable for industrial applications requiring high-speed and accurate analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,338 parts In-Stock

1+ parts

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4,338

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Digiode

USA . 4,000 parts In-Stock

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4,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 324 parts In-Stock

1+ parts

$7.000

100+ parts

-

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324

$7.000

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AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$8.949

100+ parts

-

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295

$8.949

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Parana Technologies

USA . 27 parts In-Stock

1+ parts

$22.049

100+ parts

$2,047.571

1k+ parts

$19.844

10k+ parts

-

27

$22.049

$2,047.571

$19.844

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DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$24.279

100+ parts

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10k+ parts

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2,339

$24.279

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ChromeModa Solutions

Germany . 3,449 parts In-Stock

1+ parts

$24.774

100+ parts

$20.315

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-

10k+ parts

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3,449

$24.774

$20.315

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IDEA Electronic Components Group

UK . 522 parts In-Stock

1+ parts

$24.774

100+ parts

$23.535

1k+ parts

$22.297

10k+ parts

-

522

$24.774

$23.535

$22.297

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Lixinc

USA . 16,473 parts In-Stock

1+ parts

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16,473

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Corphita

USA . 1,301 parts In-Stock

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1,301

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Overview

Unlock the power of precise data conversion with the VSP5324RGCT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This Analog-to-Digital Converter boasts 4 analog input channels, making it perfect for a variety of industrial applications. Experience the benefits of its 12-bit resolution and ultra-fast 65 MHz sample rate. Don't settle for anything less than exceptional performance - choose the VSP5324RGCT for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile data collection and processing capabilities.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into existing systems and PCB designs.

No. of Bits: 12

With a 12-bit resolution, the product can provide precise and accurate digital conversion of analog signals.

Sample Rate: 65 MHz

A high sample rate of 65 MHz allows for fast and efficient conversion of analog signals into digital data.

Technical Specifications

Analog-to-Digital Converters VSP5324RGCT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Parallel, Word, Serial

Sample Rate:

65 MHz

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

VSP5324RGCT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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