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VSP5324RGCR

Texas Instruments

VSP5324RGCR by Texas Instruments

VSP5324RGCR by Texas Instruments is a 12-bit ADC with 4 analog in channels, operating at a sample rate of 65 MHz. It comes in a square chip carrier package style with nickel palladium gold terminal finish. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,707 parts In-Stock

1+ parts

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3,707

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Vyrian

USA . 2,077 parts In-Stock

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2,077

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 711 parts In-Stock

1+ parts

$13.128

100+ parts

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711

$13.128

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Parana Technologies

USA . 404 parts In-Stock

1+ parts

$20.605

100+ parts

-

1k+ parts

$20.701

10k+ parts

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404

$20.605

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$20.701

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ChromeModa Solutions

Germany . 4,340 parts In-Stock

1+ parts

$23.152

100+ parts

$18.985

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4,340

$23.152

$18.985

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

1+ parts

$23.152

100+ parts

$21.994

1k+ parts

$20.837

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1,963

$23.152

$21.994

$20.837

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One Stop Electronics

USA . 1,128 parts In-Stock

1+ parts

$29.000

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1,128

$29.000

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DigiPath Technology Company

USA . 2,216 parts In-Stock

1+ parts

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100+ parts

$20.874

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2,216

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$20.874

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Corphita

USA . 483 parts In-Stock

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483

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Overview

Discover the Texas Instruments VSP5324RGCR, a high-quality Analog-to-Digital Converter designed to deliver exceptional performance in a variety of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers customers unparalleled value and benefits. Whether you're looking to enhance data acquisition systems or improve signal processing capabilities, the VSP5324RGCR is the perfect solution. Trust in Texas Instruments to provide innovative technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product light weight and durable.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile input options.

Surface Mount: YES

Being surface mountable makes installation and integration easier.

No. of Bits: 12

With 12 bits, this converter offers good resolution for accurate conversions.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles allows for efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and reduces chances of errors.

Sample Rate: 65 MHz

The high sample rate of 65 MHz allows for fast and accurate data conversion.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh conditions in industrial environments.

Technical Specifications

Analog-to-Digital Converters VSP5324RGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Parallel, Word, Serial

Sample Rate:

65 MHz

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

VSP5324RGCR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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