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VFC110BG1

Texas Instruments

VFC110BG1 by Texas Instruments

VFC110BG1 by Texas Instruments is a voltage to frequency converter with 14 terminals. It operates b/w -25°C to 85°C, with linearity error of 0.05%. The converter has a max supply voltage of 18V and can handle frequencies up to 4 MHz, making it ideal for precision measurement applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,845 parts In-Stock

1+ parts

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5,845

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Digiode

USA . 1,151 parts In-Stock

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1,151

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 304 parts In-Stock

1+ parts

$7.068

100+ parts

-

1k+ parts

$7.602

10k+ parts

-

304

$7.068

-

$7.602

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DigiPath Technology Company

USA . 79 parts In-Stock

1+ parts

$7.783

100+ parts

$7.161

1k+ parts

-

10k+ parts

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79

$7.783

$7.161

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ChromeModa Solutions

Germany . 1,742 parts In-Stock

1+ parts

$7.942

100+ parts

$6.512

1k+ parts

-

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1,742

$7.942

$6.512

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IDEA Electronic Components Group

UK . 208 parts In-Stock

1+ parts

$7.942

100+ parts

-

1k+ parts

$7.148

10k+ parts

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208

$7.942

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$7.148

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AZTECH Wire

Italy . 370 parts In-Stock

1+ parts

$16.865

100+ parts

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370

$16.865

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One Stop Electronics

USA . 366 parts In-Stock

1+ parts

$36.000

100+ parts

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366

$36.000

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Corphita

USA . 1,905 parts In-Stock

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1,905

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Overview

Unlock the power of precise voltage to frequency conversion with the VFC110BG1 by Texas Instruments. Crafted with top-quality ceramic and metal-sealed cofired materials, this analog special purpose converter offers unparalleled accuracy with a maximum linearity error of just 0.05%. Ideal for a wide range of applications, this versatile device boasts a dual terminal position and a compact in-line package style for easy integration. Experience the superior performance and reliability that Texas Instruments is renowned for, all while enjoying the value and benefits that the VFC110BG1 brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material ensures durability and reliability in different environmental conditions.

Maximum Supply Voltage: 18 V

The high maximum supply voltage allows for flexibility in power supply options, making this product suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this component into various circuit designs efficiently.

Maximum Linearity Error (EL): 0.05 %

The low maximum linearity error ensures accurate voltage to frequency conversion, making this product ideal for precise measurement applications.

No. of Terminals: 14

The high number of terminals allows for versatile connections and ensures compatibility with different circuit layouts.

Minimum Negative Supply Voltage: -8 V

The minimum negative supply voltage provides flexibility in power supply configurations, accommodating various system requirements.

Width: 7.62 mm

The compact width makes this product suitable for space-constrained applications where size is a critical factor.

Maximum Operating Frequency: 4 MHz

The high maximum operating frequency enables fast and efficient voltage to frequency conversion, making this product suitable for high-speed applications.

Technical Specifications

Analog Special Purpose Converters VFC110BG1 attributes and parameters. Explore more Analog Special Purpose Converters devices from Texas Instruments

Converter Specifications

Maximum Operating Frequency:

4 MHz

Maximum Linearity Error (EL):

0.05 %

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Negative Supply Voltage:

-8 V

Nominal Negative Supply Voltage:

-15 V

Maximum Negative Supply Voltage:

-18 V

Maximum Positive Input Voltage:

10 V

Minimum Supply Voltage:

8 V

Maximum Supply Voltage:

18 V

Operating Conditions

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-25 °C (-13 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.73 in (18.545 mm)

Maximum Seated Height:

0.175 in (4.45 mm)

Packaging

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Standards and Codes

Qualification:

Not Qualified

JESD-30 Code:

R-CDIP-T14

Trade Compliance

VFC110BG1 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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