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V62/22604-01XE

Texas Instruments

V62/22604-01XE by Texas Instruments

V62/22604-01XE by Texas Instruments is an 8-bit bus driver/transceiver with a supply voltage of 0.7V, operating temperature range of -55 to 125°C, and output polarity as TRUE. It features a small outline package with dual terminals and bidirectional count direction, suitable for applications requiring common control in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,425 parts In-Stock

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7,425

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Digiode

USA . 2,180 parts In-Stock

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2,180

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Distributors (Availability)

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AZTECH Wire

Italy . 229 parts In-Stock

1+ parts

$6.556

100+ parts

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229

$6.556

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Ampacity Inc.

Singapore . 1,233 parts In-Stock

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$20.000

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1,233

$20.000

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One Stop Electronics

USA . 942 parts In-Stock

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$32.000

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942

$32.000

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Semicontronic

India . 736 parts In-Stock

1+ parts

$55.000

100+ parts

$53.625

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$53.350

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736

$55.000

$53.625

$53.350

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Corphita

USA . 745 parts In-Stock

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745

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Corohmni

South Africa . 159 parts In-Stock

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159

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Overview

Elevate your electronics projects with the V62/22604-01XE by Texas Instruments, a top-of-the-line Bus Driver & Transceiver that boasts exceptional quality and reliability. Manufactured with precision using PLASTIC/EPOXY material, this versatile component is perfect for a wide range of applications. With its innovative design and advanced features, this product offers customers unparalleled value, seamless performance, and unmatched benefits. Experience the advantages of the Texas Instruments brand and take your projects to the next level with the V62/22604-01XE today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving time and effort in the assembly process.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission capabilities, making it suitable for diverse communication needs.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures reliability and functionality even in extreme environments, making it a versatile choice for different conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand heat and maintain performance under challenging conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and quality performance.

Width: 4.4 mm

The compact width makes the product space-saving and suitable for applications where board space is limited.

Output Polarity: TRUE

Having true output polarity ensures accurate data transmission, reducing errors and improving overall system performance.

Maximum Power Supply Current (ICC): 0.07 mA

The low power consumption of the product makes it energy-efficient, suitable for applications where power efficiency is important.

Technical Specifications

Bus Driver & Transceivers V62/22604-01XE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

SLC

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.07 mA

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.65 V

Nominal Supply Voltage / Vsup (V):

0.7

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

V62/22604-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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