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V62/05614-02XE

Texas Instruments

V62/05614-02XE by Texas Instruments

V62/05614-02XE by Texas Instruments is a 16-terminal line receiver with a power supply of 3.3V, operating temperature range of -55 to 125°C, and max output low current of 4A. It is designed for military-grade applications requiring EIA/TIA-644 interface standard compliance and CMOS technology for reliable data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,422 parts In-Stock

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8,422

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Digiode

USA . 830 parts In-Stock

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830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,381 parts In-Stock

1+ parts

$4.376

100+ parts

-

1k+ parts

$4.794

10k+ parts

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1,381

$4.376

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$4.794

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ChromeModa Solutions

Germany . 5,202 parts In-Stock

1+ parts

$4.917

100+ parts

$4.032

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5,202

$4.917

$4.032

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$4.917

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$4.425

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2,292

$4.917

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$4.425

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AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$6.858

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790

$6.858

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One Stop Electronics

USA . 1,168 parts In-Stock

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$27.500

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1,168

$27.500

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Corphita

USA . 2,883 parts In-Stock

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2,883

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DigiPath Technology Company

USA . 818 parts In-Stock

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$4.433

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818

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$4.433

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Overview

Experience unparalleled performance and reliability with the V62/05614-02XE by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. As a line driver and receiver, this product offers seamless communication in a compact package, ideal for military-grade applications. With a maximum supply voltage of 3.6V and advanced CMOS technology, customers can trust in its precision and durability. Elevate your projects with the unmatched quality and value that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the line driver/receiver.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Can safely handle a relatively high supply voltage, increasing versatility in different circuit configurations.

Screening Level: MIL-STD-883

Meets strict military standards for reliability and quality, ensuring consistent performance in demanding environments.

Package Shape: RECTANGULAR

Compact shape allows for space-efficient placement on the PCB, especially beneficial in crowded circuit layouts.

Minimum Operating Temperature: -55 °C

Capable of operating in extremely cold conditions without performance degradation, ideal for various industrial applications.

Interface Standard: EIA-644; TIA-644

Compliance with industry standards ensures compatibility with a wide range of communication systems, making integration easier.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to efficient and reliable signal transmission.

Technical Specifications

Line Drivers & Receivers V62/05614-02XE attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

8 ns

Receiver No. of Bits:

4

Screening Level:

MIL-STD-883

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

V62/05614-02XE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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