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V62/05604-02XA

Texas Instruments

V62/05604-02XA by Texas Instruments

V62/05604-02XA by Texas Instruments is a BICMOS line driver with 3.3V supply, 8 terminals, and 70ns receive delay. Ideal for automotive applications, it offers differential output, operates b/w -40 to 125 °C, and has a small outline package shape for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,214 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,214

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-

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Digiode

USA . 3,617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,617

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 324 parts In-Stock

1+ parts

$3.896

100+ parts

$361.759

1k+ parts

$3.506

10k+ parts

-

324

$3.896

$361.759

$3.506

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DigiPath Technology Company

USA . 2,286 parts In-Stock

1+ parts

$4.289

100+ parts

-

1k+ parts

-

10k+ parts

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2,286

$4.289

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-

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IDEA Electronic Components Group

UK . 2,289 parts In-Stock

1+ parts

$4.377

100+ parts

-

1k+ parts

$3.939

10k+ parts

-

2,289

$4.377

-

$3.939

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ChromeModa Solutions

Germany . 2,037 parts In-Stock

1+ parts

$4.377

100+ parts

$3.589

1k+ parts

-

10k+ parts

-

2,037

$4.377

$3.589

-

-

AZTECH Wire

Italy . 191 parts In-Stock

1+ parts

$6.535

100+ parts

-

1k+ parts

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10k+ parts

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191

$6.535

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One Stop Electronics

USA . 643 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

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10k+ parts

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643

$14.500

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-

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Corphita

USA . 1,196 parts In-Stock

1+ parts

-

100+ parts

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1,196

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Overview

Unlock a world of seamless communication with the V62/05604-02XA from Texas Instruments. This line driver/receiver offers unmatched quality and reliability, thanks to its innovative design and cutting-edge technology. Ideal for automotive applications and beyond, this product delivers exceptional performance while ensuring maximum efficiency. Trust Texas Instruments to provide you with a solution that exceeds your expectations, making every interaction smoother and more efficient. Elevate your projects with the V62/05604-02XA and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the line driver & receiver.

Surface Mount: YES

Being surface mountable makes installation of this product easy and convenient, especially in compact electronic designs.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V makes it compatible with a wide range of electronic systems and devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that this product can withstand extended periods of use without overheating.

Technology: BICMOS

The use of BICMOS technology in this line driver & receiver ensures high performance and efficiency in signal transmission.

Maximum Output Low Current: 8 Amp

The high maximum output low current of 8A allows for reliable and stable signal transmission in various applications.

Temperature Grade: AUTOMOTIVE

Being automotive grade means this product is designed to operate effectively in automotive environments, ensuring reliability in vehicle systems.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a standard power input for the line driver & receiver, making it compatible with many systems.

Technical Specifications

Line Drivers & Receivers V62/05604-02XA attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Maximum Receive Delay:

70 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15.5 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

V62/05604-02XA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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