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UCC3818ADRG4

Texas Instruments

UCC3818ADRG4 by Texas Instruments

UCC3818ADRG4 by Texas Instruments is a switching regulator/controller with a max output current of 1.2A and a max switching frequency of 120kHz. It is commonly used in boost switcher configurations for power factor control applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,734 parts In-Stock

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Digiode

USA . 1,573 parts In-Stock

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1,573

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Ampacity Inc.

Singapore . 1,053 parts In-Stock

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$1.500

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1,053

$1.500

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One Stop Electronics

USA . 189 parts In-Stock

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$4.500

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189

$4.500

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AZTECH Wire

Italy . 778 parts In-Stock

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$9.203

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778

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Parana Technologies

USA . 1,173 parts In-Stock

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$13.581

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$14.085

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1,173

$13.581

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$14.085

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DigiPath Technology Company

USA . 1,975 parts In-Stock

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$14.954

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$13.758

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$14.954

$13.758

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IDEA Electronic Components Group

UK . 1,980 parts In-Stock

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$15.259

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$14.496

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$13.733

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1,980

$15.259

$14.496

$13.733

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ChromeModa Solutions

Germany . 456 parts In-Stock

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$15.259

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$12.512

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456

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$12.512

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A-Z Elektronik GmbH

Germany . 9,377 parts In-Stock

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Corphita

USA . 3,521 parts In-Stock

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Continental Prestige Electronics

USA . 2,819 parts In-Stock

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Microchip USA

USA . 2,575 parts In-Stock

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Argo Parts USA

USA . 386 parts In-Stock

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386

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Discover the UCC3818ADRG4 by Texas Instruments, a top-quality switching regulator and controller that offers unrivaled value and advantages for your applications. With its cutting-edge BICMOS technology, this small outline package delivers superior performance while maintaining maximum efficiency. Whether you need precise current-mode control or pulse width modulation, this power factor controller can handle it all. Its wide input voltage range and high output current make it ideal for a variety of projects. Trust in Texas Instruments' renowned reputation for manufacturing excellence and unlock the true potential of your designs with the UCC3818ADRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Maximum Output Current: 1.2 A

The high maximum output current capability allows for powering various components and peripherals efficiently.

Control Technique: PULSE WIDTH MODULATION

Utilizing pulse width modulation control technique ensures precise regulation of output voltage for stable performance.

Maximum Switching Frequency: 120 kHz

The high switching frequency facilitates fast response times and reduces output voltage ripple for clean power delivery.

Technical Specifications

Switching Regulators & Controllers UCC3818ADRG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

15 V

Minimum Input Voltage:

10.3 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

120 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

UCC3818ADRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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