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UCC3626DWTR

Texas Instruments

UCC3626DWTR by Texas Instruments

UCC3626DWTR by Texas Instruments is a Brushless DC Motor Controller with 12V nominal voltage, 28 terminals, and 0.2A max output current. It operates b/w 0-70°C and is suitable for motion control applications requiring a small outline package style.

Median Price

$0.459

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 135 parts In-Stock

1+ parts

-

100+ parts

$0.459

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-

10k+ parts

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135

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$0.459

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.006

100+ parts

-

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-

50

$5.006

-

-

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Vyrian

USA . 8,555 parts In-Stock

1+ parts

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8,555

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Digiode

USA . 1,543 parts In-Stock

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1,543

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 135 parts In-Stock

1+ parts

$0.850

100+ parts

-

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-

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135

$0.850

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-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$5.006

100+ parts

-

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-

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50

$5.006

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AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$5.270

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-

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418

$5.270

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Parana Technologies

USA . 1,979 parts In-Stock

1+ parts

$19.200

100+ parts

-

1k+ parts

$19.243

10k+ parts

-

1,979

$19.200

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$19.243

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ChromeModa Solutions

Germany . 2,691 parts In-Stock

1+ parts

$21.573

100+ parts

$17.690

1k+ parts

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2,691

$21.573

$17.690

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IDEA Electronic Components Group

UK . 793 parts In-Stock

1+ parts

$21.573

100+ parts

$20.494

1k+ parts

$19.416

10k+ parts

-

793

$21.573

$20.494

$19.416

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Corphita

USA . 4,741 parts In-Stock

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4,741

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DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

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100+ parts

$19.450

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1,992

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$19.450

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Overview

Experience the superior quality and reliable performance of the UCC3626DWTR by Texas Instruments, a leading manufacturer in motion control ICs. Designed for efficiency and precision, this brushless DC motor controller offers seamless operation and optimal power management. Ideal for a variety of applications, this compact and versatile IC provides value and benefits that cater to the needs of customers looking for high-quality solutions. Upgrade your motion control systems with the UCC3626DWTR and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures good durability and protection for the IC, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 12 V

This voltage is common and easily accessible in many applications, making integration easier.

No. of Terminals: 28

The high number of terminals allows for more connections and functionalities in the IC.

Maximum Operating Temperature: 70 °C

This high operating temperature range ensures reliability in various environmental conditions.

Technology: BICMOS

The use of BiCMOS technology allows for a combination of high-speed logic capabilities with low-power analog performance, making the IC efficient.

Technical Specifications

Motion Control ICs UCC3626DWTR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

14.5 V

Minimum Supply Voltage (Vsup):

11 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

UCC3626DWTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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