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UCC281-5DP

Texas Instruments

UCC281-5DP by Texas Instruments

UCC281-5DP by Texas Instruments is a BICMOS technology-based LDO regulator with 1A output current and 5V nominal output voltage. It has a max dropout voltage of 0.6V, making it suitable for applications requiring precise voltage regulation in a compact small outline package style. Operating temperature range from -55°C to 150°C ensures reliable performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,917 parts In-Stock

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5,917

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Digiode

USA . 466 parts In-Stock

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466

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Distributors (Availability)

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Parana Technologies

USA . 2,240 parts In-Stock

1+ parts

$6.013

100+ parts

-

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$6.789

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2,240

$6.013

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$6.789

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DigiPath Technology Company

USA . 1,114 parts In-Stock

1+ parts

$6.621

100+ parts

$6.091

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1,114

$6.621

$6.091

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ChromeModa Solutions

Germany . 4,807 parts In-Stock

1+ parts

$6.756

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$5.540

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4,807

$6.756

$5.540

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IDEA Electronic Components Group

UK . 350 parts In-Stock

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$6.756

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$6.080

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350

$6.756

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$6.080

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Ampacity Inc.

Singapore . 1,534 parts In-Stock

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$7.500

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1,534

$7.500

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AZTECH Wire

Italy . 396 parts In-Stock

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$12.738

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396

$12.738

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One Stop Electronics

USA . 879 parts In-Stock

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$16.500

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879

$16.500

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Semicontronic

India . 985 parts In-Stock

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$23.500

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$22.912

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$22.795

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985

$23.500

$22.912

$22.795

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Corphita

USA . 476 parts In-Stock

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Corohmni

South Africa . 368 parts In-Stock

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Overview

Upgrade your power management system with the UCC281-5DP from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable fixed regulators that are perfect for a wide range of applications. With a maximum output current of 1A and a dropout voltage of just 0.6V, this LDO regulator offers unparalleled performance and efficiency. Say goodbye to power fluctuations and hello to stability with the UCC281-5DP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Maximum Dropout Voltage-1: 1.6 V

Low dropout voltage ensures efficient regulation even when the input voltage is close to the output voltage, reducing power dissipation.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance, low power consumption, and high integration.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to work with, making it compatible with standard PCB layouts.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connection and are suitable for automated soldering processes, ensuring reliable electrical connections.

Operating Temperature (TJ-Min): -55 °C

Wide temperature range ensures the product can operate in extreme cold conditions.

Minimum Output Voltage-1: 4.875 V

Low minimum output voltage allows for powering sensitive components that require precise voltage regulation.

Maximum Voltage Tolerance: 2.5 %

Tight voltage tolerance ensures stable and accurate output voltage, reducing the risk of damage to connected devices.

Nominal Output Voltage-1: 5 V

Stable nominal output voltage makes it suitable for a wide range of applications that require a fixed voltage supply.

No. of Terminals: 8

Sufficient number of terminals for easy connectivity, enabling versatile application options.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact device designs.

Terminal Pitch: 1.27 mm

Wide terminal pitch makes it easy to solder and install the product, suitable for automated assembly processes.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed positive LDO regulator provides reliable voltage regulation without the need for external components, simplifying circuit design.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection options.

Maximum Output Voltage-1: 5.125 V

High maximum output voltage provides a margin for voltage fluctuations, ensuring stable power supply to connected devices.

Maximum Seated Height: 1.75 mm

Low seated height allows for a compact overall device size and facilitates space-constrained applications.

Width: 3.9 mm

Narrow width saves space on the PCB and enables dense component placement.

Maximum Load Regulation: 0.005 %

Low load regulation ensures stable output voltage regardless of the load variations, enhancing the performance of connected devices.

Minimum Input Voltage: 5.15 V

Low minimum input voltage requirement allows for use with a wide range of power sources, increasing flexibility in application design.

Maximum Output Current-1: 1 A

High maximum output current capability allows for powering multiple components or devices without the risk of overload.

Length: 4.89 mm

Compact length makes it suitable for small and space-constrained device designs.

Maximum Input Voltage: 9 V

Wide input voltage range allows for compatibility with various power sources, increasing the versatility of the product.

Technical Specifications

Fixed Regulators - Positive Single Output LDO UCC281-5DP attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.6 V

Maximum Input Voltage:

9 V

Minimum Input Voltage:

5.15 V

JESD-30 Code:

R-PDSO-G8

Length:

4.89 mm

Maximum Load Regulation:

.005 %

No. of Functions:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

5.125 V

Minimum Output Voltage-1:

4.875 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

3.9 mm

Trade Compliance

UCC281-5DP Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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