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UCC2806PWTRG4

Texas Instruments

UCC2806PWTRG4 by Texas Instruments

UCC2806PWTRG4 by Texas Instruments is a switching controller with a current-mode control technique. It operates in an industrial temperature grade range from -40 to 85°C, suitable for various applications requiring a min output voltage of 5.02V and max output current of 0.5A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,178 parts In-Stock

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Digiode

USA . 1,533 parts In-Stock

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1,533

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Nova Conductors

Japan . 10 parts In-Stock

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10

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One Stop Electronics

USA . 1,494 parts In-Stock

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$6.500

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$6.500

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Ampacity Inc.

Singapore . 1,073 parts In-Stock

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$6.500

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Parana Technologies

USA . 2,032 parts In-Stock

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$10.483

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$973.534

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$9.435

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2,032

$10.483

$973.534

$9.435

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DigiPath Technology Company

USA . 968 parts In-Stock

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$11.543

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$10.620

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968

$11.543

$10.620

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IDEA Electronic Components Group

UK . 1,447 parts In-Stock

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$11.779

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$11.190

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$10.601

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1,447

$11.779

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$10.601

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ChromeModa Solutions

Germany . 639 parts In-Stock

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$11.779

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$9.659

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639

$11.779

$9.659

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AZTECH Wire

Italy . 590 parts In-Stock

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$13.440

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S.R.D Solutions

India . 7,200 parts In-Stock

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Microchip USA

USA . 2,107 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,096 parts In-Stock

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Overview

Enhance the efficiency and reliability of your power supply designs with the UCC2806PWTRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and performance in switching regulators & controllers. This versatile product offers current-mode control mode, pulse width modulation, and a maximum switching frequency of 1000 kHz, making it perfect for a wide range of industrial applications. With a compact design, high output current, and industrial-grade temperature grade, the UCC2806PWTRG4 provides exceptional value and benefits to customers seeking superior power management solutions. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and is lightweight, making the product durable and easy to handle.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Control Mode: CURRENT-MODE

Current mode control offers better transient response and stability, enhancing the overall performance of the regulator.

Maximum Switching Frequency: 1000 kHz

High switching frequency allows for smaller and more efficient designs, reducing overall size and power consumption.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high speed and low power consumption.

Technical Specifications

Switching Regulators & Controllers UCC2806PWTRG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN ADJUSTABLE MODE FROM 2.5V TO 15V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14.5 V

Minimum Input Voltage:

8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Maximum Output Voltage:

5.17 V

Minimum Output Voltage:

5.02 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Voltage (Vsup):

14.5 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

UCC2806PWTRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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