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UCC2570DG4

Texas Instruments

UCC2570DG4 by Texas Instruments

UCC2570DG4 by Texas Instruments is a voltage-mode switching controller with a max output current of 1.2A and a max switching frequency of 500kHz. It operates in an industrial temperature range from -40°C to 85°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,407 parts In-Stock

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3,407

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Vyrian

USA . 2,626 parts In-Stock

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2,626

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Distributors (Availability)

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Parana Technologies

USA . 799 parts In-Stock

1+ parts

$3.392

100+ parts

-

1k+ parts

$3.918

10k+ parts

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799

$3.392

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$3.918

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DigiPath Technology Company

USA . 114 parts In-Stock

1+ parts

$3.735

100+ parts

$3.436

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-

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114

$3.735

$3.436

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ChromeModa Solutions

Germany . 471 parts In-Stock

1+ parts

$3.811

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$3.125

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471

$3.811

$3.125

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IDEA Electronic Components Group

UK . 282 parts In-Stock

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$3.811

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$3.430

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282

$3.811

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$3.430

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One Stop Electronics

USA . 1,382 parts In-Stock

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$4.500

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1,382

$4.500

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Semicontronic

India . 607 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

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$6.305

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607

$6.500

$6.338

$6.305

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Ampacity Inc.

Singapore . 1,550 parts In-Stock

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$7.500

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1,550

$7.500

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AZTECH Wire

Italy . 564 parts In-Stock

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$12.017

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564

$12.017

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Corphita

USA . 2,960 parts In-Stock

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2,960

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Microchip USA

USA . 372 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Overview

Unlock the power of efficient control and regulation with the Texas Instruments UCC2570DG4 switching regulator and controller. Crafted with precision and expertise, this small outline package offers a wide range of applications in voltage-mode control. With a maximum output current of 1.2A and a maximum switching frequency of 500 kHz, this industrial-grade device ensures reliable performance in various settings. Trust Texas Instruments to deliver top-notch quality and cutting-edge technology for your switching needs. Elevate your projects with the UCC2570DG4 and experience unparalleled value and benefits like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ensures long-term reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly.

No. of Terminals: 14

Having 14 terminals enables more flexibility in connecting the device to other components in the circuit.

Maximum Output Current: 1.2 A

The high maximum output current of 1.2A allows the regulator to power a variety of components in the circuit effectively.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation for control allows for efficient regulation of the output voltage, ensuring stable performance.

Technical Specifications

Switching Regulators & Controllers UCC2570DG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN CURRENT MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

500 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

UCC2570DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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