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UC3908D

Texas Instruments

UC3908D by Texas Instruments

UC3908D by Texas Instruments is a voltage reference with 3.3V to 9V output range, ideal for commercial applications. It features a max output current of 20A and operates b/w 0°C to 70°C temperature range. This small outline package with gull wing terminals is surface mountable for easy integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,756 parts In-Stock

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Digiode

USA . 486 parts In-Stock

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486

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Semicontronic

India . 213 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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213

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,230 parts In-Stock

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$6.500

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$6.500

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One Stop Electronics

USA . 426 parts In-Stock

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$7.500

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426

$7.500

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AZTECH Wire

Italy . 693 parts In-Stock

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$9.466

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693

$9.466

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Parana Technologies

USA . 1,862 parts In-Stock

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$19.331

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$19.352

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1,862

$19.331

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$19.352

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DigiPath Technology Company

USA . 1,802 parts In-Stock

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$21.286

100+ parts

$19.583

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1,802

$21.286

$19.583

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ChromeModa Solutions

Germany . 1,635 parts In-Stock

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$21.720

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$17.810

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1,635

$21.720

$17.810

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IDEA Electronic Components Group

UK . 1,100 parts In-Stock

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$21.720

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$20.634

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$19.548

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$21.720

$20.634

$19.548

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Corphita

USA . 389 parts In-Stock

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Corohmni

South Africa . 63 parts In-Stock

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Overview

Unlock the power of precise voltage regulation with the UC3908D by Texas Instruments. Designed for exceptional reliability and performance, this voltage reference is a game-changer in various applications where stability is key. Whether you're in the automotive industry, telecommunications, or consumer electronics, the UC3908D ensures consistent and accurate output voltages between 3.3V to 9V. Trust in Texas Instruments' expertise and elevate your designs with this cutting-edge solution that guarantees unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the assembly process.

No. of Terminals: 8

8 terminals provide flexibility in connecting the voltage reference to other components or systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can function reliably in a wide range of conditions.

Minimum Output Voltage: 3.3 V

The minimum output voltage of 3.3 V ensures compatibility with a variety of voltage requirements in different applications.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C allows for reliable performance in cold environments.

Maximum Output Voltage: 9 V

The maximum output voltage of 9 V meets the power needs of many electronic devices and systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is suitable for standard commercial applications.

Technology: BIPOLAR

Bipolar technology offers good precision and stability in voltage references, ensuring accurate voltage outputs.

Technical Specifications

Voltage References UC3908D attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

20 A

Maximum Output Voltage:

9 V

Minimum Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UC3908D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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