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UA9637ACDE4

Texas Instruments

UA9637ACDE4 by Texas Instruments

UA9637ACDE4 by Texas Instruments is a Line Receiver IC with 2 functions, operating at 5V. It features EIA-422-B and TIA-422-B interface standards, with a max supply voltage of 5.25V. Ideal for applications requiring differential Schmitt trigger input characteristics in commercial temperature grades.

Median Price

$0.580

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 200 parts In-Stock

1+ parts

$0.580

100+ parts

$0.570

1k+ parts

$0.560

10k+ parts

-

200

$0.580

$0.570

$0.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,378 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

2,378

$0.855

-

-

-

Vyrian

USA . 6,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,340

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,469 parts In-Stock

1+ parts

$0.810

100+ parts

-

1k+ parts

-

10k+ parts

-

3,469

$0.810

-

-

-

Parana Technologies

USA . 734 parts In-Stock

1+ parts

$7.647

100+ parts

-

1k+ parts

$8.166

10k+ parts

-

734

$7.647

-

$8.166

-

DigiPath Technology Company

USA . 2,061 parts In-Stock

1+ parts

$8.420

100+ parts

$7.747

1k+ parts

-

10k+ parts

-

2,061

$8.420

$7.747

-

-

ChromeModa Solutions

Germany . 3,332 parts In-Stock

1+ parts

$8.592

100+ parts

$7.045

1k+ parts

-

10k+ parts

-

3,332

$8.592

$7.045

-

-

IDEA Electronic Components Group

UK . 285 parts In-Stock

1+ parts

$8.592

100+ parts

$8.162

1k+ parts

$7.733

10k+ parts

-

285

$8.592

$8.162

$7.733

-

Perfect Parts

USA . 487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

487

-

-

-

-

Assy Fe

Spain . 343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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343

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Overview

Enhance your electronic designs with the UA9637ACDE4 by Texas Instruments, a top-of-the-line line driver and receiver. Crafted with precision and expertise, Texas Instruments delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications, this component offers seamless integration and optimal performance. Elevate your projects with the value, benefits, and advantages that only Texas Instruments can provide. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.25 V

Can handle a wide range of supply voltages, providing flexibility in different applications.

No. of Functions: 2

Offers multiple functions in a single product, reducing the need for additional components and simplifying the design.

Package Shape: RECTANGULAR

Provides a standardized shape for easy integration into existing systems or PCB layouts.

Power Supplies (V): 5

Operates efficiently with a common supply voltage, ensuring compatibility with many systems.

No. of Terminals: 8

Provides multiple connection points for versatile integration and robust signal transmission.

Package Style (Meter): SMALL OUTLINE

Compact design saves space and allows for high-density mounting on PCBs.

Minimum Supply Voltage: 4.75 V

Can operate effectively even with slightly lower supply voltages, ensuring reliable performance in varying conditions.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for demanding industrial or automotive applications.

Minimum Operating Temperature: 0 °C

Operates reliably even at low temperatures, ensuring consistent performance in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Allows for flexible installation and connection options, ensuring compatibility with various systems.

Maximum Seated Height: 1.75 mm

Low profile design saves space and allows for compact system integration.

Width: 3.9 mm

Compact width facilitates high-density mounting and efficient use of space on PCBs.

Maximum Output Low Current: 20 Amp

Can deliver high current outputs, making it suitable for driving demanding loads.

Receiver No. of Bits: 2

Provides accurate signal reception and processing for reliable data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during the manufacturing process.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, ensuring reliable solder joints during assembly.

Length: 4.9 mm

Compact length allows for efficient use of space on PCBs and in system designs.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, offering reliable performance in typical operating environments.

Maximum Receive Delay: 25 ns

Provides fast response times for signal reception and processing, ensuring minimal delays in data transmission.

Technology: BIPOLAR

Utilizes bipolar technology for efficient signal processing and reliable performance in various applications.

Terminal Form: GULL WING

Facilitates secure and reliable soldering connections, ensuring robust connections on PCBs.

Interface Standard: EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

Complies with industry standards for signal interfaces, ensuring compatibility with a wide range of systems and devices.

Maximum Supply Current: 50 mA

Operates efficiently with low current consumption, minimizing power requirements and heat generation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides accurate signal reception and noise immunity for reliable data transmission.

Nominal Supply Voltage: 5 V

Operates efficiently with a common supply voltage, ensuring compatibility with many systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy installation and connection on PCBs.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate moisture exposure during storage or operation, ensuring reliability in humid environments.

Interface IC Type: LINE RECEIVER

Specifically designed for reliable signal reception and processing in line driver and receiver applications.

Technical Specifications

Line Drivers & Receivers UA9637ACDE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

20 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

UA9637ACDE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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