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TVP7000PZPR

Texas Instruments

TVP7000PZPR by Texas Instruments

TVP7000PZPR by Texas Instruments is a consumer IC with 100 terminals, operating at 0-70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications like consumer circuits due to its compact square package design and surface-mount capability.

Median Price

$4.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$3.830

1k+ parts

$3.430

10k+ parts

$3.220

7,000

-

$3.830

$3.430

$3.220

DigiKey

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$4.420

1k+ parts

-

10k+ parts

-

7,000

-

$4.420

-

-

Verical

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$4.787

1k+ parts

$4.287

10k+ parts

$4.025

7,000

-

$4.787

$4.287

$4.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,946 parts In-Stock

1+ parts

$4.038

100+ parts

-

1k+ parts

-

10k+ parts

-

3,946

$4.038

-

-

-

Vyrian

USA . 3,652 parts In-Stock

1+ parts

$4.250

100+ parts

-

1k+ parts

-

10k+ parts

-

3,652

$4.250

-

-

-

DigiKey Marketplace

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 257 parts In-Stock

1+ parts

$0.554

100+ parts

-

1k+ parts

$1.655

10k+ parts

-

257

$0.554

-

$1.655

-

DigiPath Technology Company

USA . 2,255 parts In-Stock

1+ parts

$0.610

100+ parts

$0.561

1k+ parts

-

10k+ parts

-

2,255

$0.610

$0.561

-

-

ChromeModa Solutions

Germany . 2,821 parts In-Stock

1+ parts

$0.622

100+ parts

$0.510

1k+ parts

-

10k+ parts

-

2,821

$0.622

$0.510

-

-

IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$0.622

100+ parts

-

1k+ parts

$0.560

10k+ parts

-

1,353

$0.622

-

$0.560

-

Corphita

USA . 4,663 parts In-Stock

1+ parts

$3.825

100+ parts

-

1k+ parts

-

10k+ parts

-

4,663

$3.825

-

-

-

A-Z Elektronik GmbH

Germany . 6,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,716

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Authorized Procurement Solutions

USA . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Microchip USA

USA . 175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

175

-

-

-

-

Overview

Elevate your consumer electronics with the TVP7000PZPR by Texas Instruments. Crafted with precision and quality, this IC offers unmatched performance and reliability. Whether you're designing cutting-edge smart devices or innovative gadgets, this versatile component will exceed your expectations. Trust in Texas Instruments' legacy of excellence and innovation to bring value and efficiency to your projects. Upgrade your products today with the TVP7000PZPR and experience a new level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, making it suitable for portable consumer electronics applications.

Surface Mount: YES

Surface mount capability allows for easy and automated assembly processes, increasing production efficiency.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for versatile integration into different electronic systems.

Package Shape: SQUARE

Square package shape ensures efficient use of board space and easy placement on PCBs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in a variety of operating conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position facilitates secure placement and soldering on the PCB for stable connections.

Width: 14 mm

Compact width of 14mm allows for efficient board space utilization and integration in small form factor devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering process during assembly.

Technical Specifications

Other Function Consumer ICs TVP7000PZPR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TVP7000PZPR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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