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TVP3025-175MDN

Texas Instruments

TVP3025-175MDN by Texas Instruments

TVP3025-175MDN by Texas Instruments is an 8-bit D/A converter with 0.39% EL, operating at 0-70°C. It has 3 functions, 160 terminals, and uses CMOS technology. Suitable for applications requiring precise analog signal conversion in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,220 parts In-Stock

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8,220

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Digiode

USA . 3,859 parts In-Stock

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3,859

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Distributors (Availability)

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AZTECH Wire

Italy . 787 parts In-Stock

1+ parts

$14.630

100+ parts

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787

$14.630

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Parana Technologies

USA . 746 parts In-Stock

1+ parts

$22.845

100+ parts

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1k+ parts

$23.505

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746

$22.845

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$23.505

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One Stop Electronics

USA . 1,195 parts In-Stock

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$24.000

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1,195

$24.000

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DigiPath Technology Company

USA . 1,566 parts In-Stock

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$25.156

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$23.143

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1,566

$25.156

$23.143

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IDEA Electronic Components Group

UK . 1,710 parts In-Stock

1+ parts

$25.669

100+ parts

$24.386

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$23.102

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1,710

$25.669

$24.386

$23.102

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ChromeModa Solutions

Germany . 1,001 parts In-Stock

1+ parts

$25.669

100+ parts

$21.049

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1,001

$25.669

$21.049

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Corphita

USA . 2,912 parts In-Stock

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2,912

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Overview

Discover the TVP3025-175MDN by Texas Instruments, a top-quality D/A converter designed to deliver superior performance in a variety of applications. With a focus on precision and reliability, Texas Instruments has crafted this converter with the latest CMOS technology, ensuring optimal functionality and efficiency. Whether you're looking to enhance audio systems, instrumentation, or communication devices, the TVP3025-175MDN offers unmatched value, benefits, and advantages that will elevate your projects to new heights. Trust Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal for the package body material provides durability and protection for the internal components, making this product suitable for rugged environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 3

With multiple functions in one converter, this product offers versatility and saves space on the board, making it a cost-effective solution.

Package Shape: SQUARE

The square package shape provides stability and easy mounting on the board, ensuring reliable performance in various applications.

No. of Bits: 8

The 8-bit resolution provides high accuracy and precision in converting analog signals to digital, making this product suitable for demanding applications.

Maximum Linearity Error (EL): 0.39%

The low linearity error ensures accurate output values, meeting the performance requirements of the system and delivering reliable results.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5V makes this converter compatible with standard power sources, offering easy integration into existing systems.

No. of Terminals: 160

The high number of terminals allows for connectivity to multiple components, enabling enhanced functionality and flexibility in system design.

Package Style (Meter): FLATPACK

The flatpack package style offers compactness and efficient use of space on the circuit board, ideal for applications with limited board real estate.

Maximum Operating Temperature: 70 °C

Operating up to a maximum temperature of 70°C ensures reliable performance in various environments, making this product suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this converter can withstand cold conditions, providing reliable operation in diverse settings.

Terminal Position: QUAD

The quad terminal position allows for easy connection and secure mounting on the board, ensuring stable performance in demanding applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades makes this product suitable for standard commercial applications, offering reliable operation in typical operating conditions.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high reliability, making this converter energy-efficient and suitable for long-term use.

Terminal Form: GULL WING

The gull wing terminal form offers secure attachment and easy soldering to the board, ensuring stable connections for reliable performance.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product enables conversion of digital signals into analog outputs, making it essential for various signal processing applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes this product compatible with standard power sources, offering ease of integration into existing systems.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for compact layout and space-saving design on the board, ideal for applications with limited board space.

Technical Specifications

Other Function Converters TVP3025-175MDN attributes and parameters. Explore more Other Function Converters devices from Texas Instruments

Converter Specifications

Converter Type:

Technology:

CMOS

No. of Bits:

8

No. of Functions:

3

Maximum Linearity Error (EL):

0.39 %

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

160

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Shape:

Package Body Material:

Metal

Package Code:

QFP

Package Style:

Flatpack

Package Equivalence Code:

QFP160,1.2SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-MQFP-G160

Trade Compliance

TVP3025-175MDN Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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