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TUSB1002IRGET

Texas Instruments

TUSB1002IRGET by Texas Instruments

TUSB1002IRGET by Texas Instruments is a Line Transceiver IC with 2 functions, operating at -40 to 85°C. It features a 3.6V max supply voltage, differential input characteristics, and nickel palladium gold terminal finish. Ideal for industrial applications requiring reliable data transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,322 parts In-Stock

1+ parts

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3,322

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Digiode

USA . 2,519 parts In-Stock

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2,519

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,649 parts In-Stock

1+ parts

$9.420

100+ parts

-

1k+ parts

$10.039

10k+ parts

-

1,649

$9.420

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$10.039

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DigiPath Technology Company

USA . 1,869 parts In-Stock

1+ parts

$10.372

100+ parts

$9.543

1k+ parts

-

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1,869

$10.372

$9.543

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ChromeModa Solutions

Germany . 4,872 parts In-Stock

1+ parts

$10.584

100+ parts

$8.679

1k+ parts

-

10k+ parts

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4,872

$10.584

$8.679

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IDEA Electronic Components Group

UK . 966 parts In-Stock

1+ parts

$10.584

100+ parts

$10.055

1k+ parts

$9.526

10k+ parts

-

966

$10.584

$10.055

$9.526

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AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$13.072

100+ parts

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442

$13.072

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One Stop Electronics

USA . 631 parts In-Stock

1+ parts

$24.500

100+ parts

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631

$24.500

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Component Stockers USA

USA . 704 parts In-Stock

1+ parts

$99.990

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704

$99.990

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Corphita

USA . 4,979 parts In-Stock

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4,979

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Microchip USA

USA . 478 parts In-Stock

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478

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Overview

Experience the cutting-edge technology of Texas Instruments with the TUSB1002IRGET Line Driver & Receiver. This product offers unmatched quality and reliability, perfect for industrial applications where precision is key. With a compact chip carrier package and differential output, this line transceiver ensures seamless communication at all times. Upgrade your systems with Texas Instruments and enjoy the benefits of superior performance and durability. Choose the TUSB1002IRGET for your next project and experience the difference that industry-leading technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the device, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, making it suitable for a wide range of industrial applications.

No. of Functions: 2

Having 2 functions in one package provides versatility and reduces the need for multiple components, simplifying design and implementation.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on circuit boards, ensuring proper connectivity and signal transmission.

No. of Terminals: 24

With 24 terminals, this product offers ample connectivity options, supporting complex circuit configurations and signal routing.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles ensures compatibility with different mounting options and space constraints, making it versatile for various applications.

Minimum Supply Voltage: 3 V

Supports a low minimum supply voltage, enabling energy-efficient operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, ensuring reliability in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term signal integrity.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1 mm

Low seated height enables compact design and efficient use of space on circuit boards.

Width: 4 mm

Compact width allows for easy integration into tight spaces, ideal for applications with limited board real estate.

Receiver No. of Bits: 2

2 bits receiver ensures accurate signal reception and processing, enhancing data transmission reliability.

Differential Output: YES

Differential output helps eliminate common-mode noise and improve noise immunity, resulting in cleaner and more reliable signal transmission.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature allows for proper soldering and rework processes without damaging the device.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and reliability during manufacturing processes.

Length: 4 mm

Compact length makes it suitable for applications with limited space constraints, providing flexibility in design and layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making it suitable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and reduces potential health hazards during manufacturing and disposal.

Input Characteristics: DIFFERENTIAL

Differential input characteristics help minimize noise and interference, ensuring accurate and reliable signal processing.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable power input for consistent performance and compatibility with standard voltage levels.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and precise soldering, facilitating compact circuit designs.

Driver No. of Bits: 2

2 bits driver ensures accurate signal amplification and transmission, enhancing overall system performance.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional communication and signal conversion, making it suitable for data transmission applications.

Technical Specifications

Line Drivers & Receivers TUSB1002IRGET attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

2

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TUSB1002IRGET Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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