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TSW7001EVM

Texas Instruments

TSW7001EVM by Texas Instruments

TSW7001EVM by Texas Instruments is an Op Amp Evaluation Board with a single channel and 710 MHz bandwidth. It features a variable gain amplifier with 2500V/µs slew rate, ideal for testing DAC8831, OPA656, VCA824 ICs. This fully populated board operates on ±5V ~ 6V supply voltage and is designed for high-speed signal processing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,829 parts In-Stock

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Digiode

USA . 3,368 parts In-Stock

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AZTECH Wire

Italy . 212 parts In-Stock

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$5.444

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Semicontronic

India . 312 parts In-Stock

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$30.100

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$29.348

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$29.197

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One Stop Electronics

USA . 1,055 parts In-Stock

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$101.100

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$101.100

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Ampacity Inc.

Singapore . 1,364 parts In-Stock

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$206.100

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ChromeModa Solutions

Germany . 2,595 parts In-Stock

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Corphita

USA . 2,558 parts In-Stock

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IDEA Electronic Components Group

UK . 2,096 parts In-Stock

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DigiPath Technology Company

USA . 913 parts In-Stock

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Parana Technologies

USA . 442 parts In-Stock

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Corohmni

South Africa . 88 parts In-Stock

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Overview

Unlock the full potential of your designs with the TSW7001EVM by Texas Instruments. This high-quality evaluation board offers variable gain amplification in a single-ended output configuration, making it perfect for a wide range of applications. With a 710 MHz bandwidth and 2500V/µs slew rate, this board delivers exceptional performance and precision. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and benefits that the TSW7001EVM brings to your projects. Elevate your designs with the best tools in the industry.

Feature Benefit Bullets

Channels per IC: 1 - Single

Having a single channel per IC allows for precise control and monitoring of the output signal, making this evaluation board a great choice for applications requiring individual channel operation.

Amplifier Type: Variable Gain

The variable gain amplifier type offers flexibility in adjusting the amplification level, catering to a wide range of signal processing requirements and enhancing the versatility of this evaluation board.

Slew Rate: 2500V/µs

With a high slew rate of 2500V/µs, this evaluation board enables fast response times and ensures accurate signal processing, making it ideal for applications that demand high-speed performance.

-3db Bandwidth: 710 MHz

The wide -3db bandwidth of 710 MHz indicates the board's ability to handle high-frequency signals with efficiency, making it a suitable choice for applications requiring broad frequency response and signal fidelity.

Voltage - Supply, Single/Dual (±): ±5V ~ 6V

The wide range of supply voltage options from ±5V to ±6V provides compatibility with a variety of power sources, offering versatility and ease of integration in different systems.

Technical Specifications

Additional Parts TSW7001EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Channels per IC:

1 - Single

Category:

Development Boards, Kits, Programmers
Evaluation Boards Op Amp Evaluation Boards

Output Type:

Single-Ended

-3db Bandwidth:

710 MHz

Slew Rate:

2500V/µs

Current - Supply (Main IC):

36.5 mA

Standard Package:

1

Supplied Contents:

Board(s)

Board Type:

Fully Populated

Voltage - Supply, Single/Dual (±):

±5V ~ 6V

Utilized IC / Part:

DAC8831, OPA656, VCA824

Package:

Box

Amplifier Type:

Variable Gain

Current - Output / Channel:

90 mA

Base Product Number:

TSW700

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TSW7001EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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