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TSP5110AN

Texas Instruments

TSP5110AN by Texas Instruments

TSP5110AN by Texas Instruments is a Speech Synthesizer IC with 28 terminals in an IN-LINE package. Operating temperature range of 0-70°C, MOS technology, and max supply current of 35mA. Ideal for music & sound applications requiring speech synthesis capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,119 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,119

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Digiode

USA . 4,980 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,980

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 371 parts In-Stock

1+ parts

$0.792

100+ parts

-

1k+ parts

$1.776

10k+ parts

-

371

$0.792

-

$1.776

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DigiPath Technology Company

USA . 1,141 parts In-Stock

1+ parts

$0.872

100+ parts

$0.802

1k+ parts

-

10k+ parts

-

1,141

$0.872

$0.802

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IDEA Electronic Components Group

UK . 631 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

$0.801

10k+ parts

-

631

$0.890

-

$0.801

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ChromeModa Solutions

Germany . 615 parts In-Stock

1+ parts

$0.890

100+ parts

$0.730

1k+ parts

-

10k+ parts

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615

$0.890

$0.730

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AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$7.709

100+ parts

-

1k+ parts

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10k+ parts

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725

$7.709

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One Stop Electronics

USA . 408 parts In-Stock

1+ parts

$20.800

100+ parts

-

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408

$20.800

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Corphita

USA . 2,490 parts In-Stock

1+ parts

-

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2,490

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Overview

Unleash the power of sound with the TSP5110AN from Texas Instruments, a leading manufacturer known for top-quality products. This Speech Synthesizer IC is perfect for music enthusiasts and professionals alike, offering unmatched performance and reliability. Whether you're creating your own electronic music or enhancing speech recognition systems, this versatile IC delivers crystal-clear sound and precision control. Elevate your projects with the TSP5110AN and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-lasting performance and ease of handling.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into electronic devices or circuits.

General IC Type: SPEECH SYNTHESIZER

Speech synthesizer capability enables the creation of realistic and natural-sounding speech in electronic applications, which can be a valuable feature for various products.

No. of Terminals: 28

Having 28 terminals provides plenty of connectivity options for interfacing with other components or peripherals, enhancing the versatility of the product.

Package Style (Meter): IN-LINE

In-line package style offers easy mounting and integration into circuit layouts, making it convenient for assembly and design considerations.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance under varying environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures functionality in colder environments, providing versatility in usage scenarios.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connection options, allowing for customized setups and configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for typical consumer electronics applications, making it a reliable choice for various commercial products.

Technology: MOS

MOS technology provides low power consumption and high efficiency, making the product energy-efficient and suitable for portable or battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy soldering and secure connections, ensuring stable performance and ease of assembly.

Maximum Supply Current: 35 mA

With a maximum supply current of 35 mA, the product can operate efficiently without drawing excessive power, making it suitable for energy-conscious applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for precise and secure connections, enhancing reliability and preventing signal interference in the circuit layout.

Technical Specifications

Music & Sound Synthesizer ICs TSP5110AN attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

35 mA

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TSP5110AN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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