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TSM102AIDRG4

Texas Instruments

TSM102AIDRG4 by Texas Instruments

TSM102AIDRG4 by Texas Instruments is an Operational Amplifier with 6500uV Max Input Offset Voltage, 90dB Nominal CMRR, and 1.3V/us Min Slew Rate. Widely used in industrial applications for its 16 terminals, Vsup of 5V, and compact small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,564 parts In-Stock

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9,564

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Digiode

USA . 1,260 parts In-Stock

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1,260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 784 parts In-Stock

1+ parts

$2.796

100+ parts

-

1k+ parts

$3.282

10k+ parts

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784

$2.796

-

$3.282

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DigiPath Technology Company

USA . 252 parts In-Stock

1+ parts

$3.079

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-

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252

$3.079

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ChromeModa Solutions

Germany . 6,451 parts In-Stock

1+ parts

$3.142

100+ parts

$2.576

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6,451

$3.142

$2.576

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IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$3.142

100+ parts

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$2.828

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273

$3.142

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$2.828

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One Stop Electronics

USA . 884 parts In-Stock

1+ parts

$3.410

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884

$3.410

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AZTECH Wire

Italy . 604 parts In-Stock

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$7.269

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604

$7.269

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Corphita

USA . 3,872 parts In-Stock

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Overview

Enhance your electronic designs with the TSM102AIDRG4 operational amplifier by Texas Instruments. Crafted with precision and expertise, this amplifier offers unparalleled performance and reliability. Ideal for a wide range of applications, from audio equipment to industrial machinery, this op amp provides exceptional value and benefits to customers. Trust in Texas Instruments to deliver top-notch quality and innovation, making the TSM102AIDRG4 the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and reliable housing for the operational amplifier.

Maximum Input Offset Voltage: 6500 uV

Low input offset voltage ensures accurate signal processing.

Surface Mount: YES

Easy to solder onto circuit boards, saving time and effort.

Nominal Common Mode Reject Ratio: 90 dB

High common mode rejection ratio helps in minimizing noise and interference.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard supply voltage of 5V.

Minimum Slew Rate: 1.3 V/us

Fast slew rate allows for quick response to input signal changes.

Maximum Supply Voltage Limit: 36 V

Can handle high supply voltages, increasing versatility in circuit design.

Frequency Compensation: YES

Ensures stability and optimal performance of the operational amplifier.

Technology: BIPOLAR

Bipolar technology offers high performance and reliability.

Architecture: VOLTAGE-FEEDBACK

Provides precise voltage amplification and low distortion.

Technical Specifications

Operational Amplifiers (Op Amps) TSM102AIDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

3/30 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

1.3 V/us

Nominal Slew Rate:

2 V/us

Peak Bias Current:

200 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.39 in (9.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

16

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP16,.25

Trade Compliance

TSM102AIDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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