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TSL401

Texas Instruments

TSL401 by Texas Instruments

TSL401 by Texas Instruments is a 10.16mm linear output photo IC with a nominal voltage of 5V and operating temperature range of 0-70°C. Ideal for optoelectronic applications, it features through-hole mounting and complex configuration for precise light sensing in various environments.

Median Price

$49.950

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 53 parts In-Stock

1+ parts

$49.950

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53

$49.950

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Vyrian

USA . 8,426 parts In-Stock

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Digiode

USA . 2,091 parts In-Stock

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2,091

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 3 parts In-Stock

1+ parts

$0.513

100+ parts

-

1k+ parts

$1.631

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3

$0.513

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$1.631

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DigiPath Technology Company

USA . 1,665 parts In-Stock

1+ parts

$0.564

100+ parts

$0.519

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1,665

$0.564

$0.519

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IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$0.576

100+ parts

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1k+ parts

$0.518

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1,476

$0.576

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$0.518

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ChromeModa Solutions

Germany . 144 parts In-Stock

1+ parts

$0.576

100+ parts

$0.472

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144

$0.576

$0.472

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One Stop Electronics

USA . 264 parts In-Stock

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$4.100

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264

$4.100

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AZTECH Wire

Italy . 282 parts In-Stock

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$14.546

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282

$14.546

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Corphita

USA . 4,934 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Discover the TSL401 by Texas Instruments, a high-quality Photo IC Sensor that offers unmatched precision and reliability. Manufactured by the renowned Texas Instruments, this sensor is perfect for a wide range of applications. From industrial automation to consumer electronics, the TSL401 delivers accurate and consistent performance every time. With its compact size and versatile configuration, this sensor is a valuable addition to any project. Experience the benefits of superior quality and performance with the TSL401 from Texas Instruments.

Feature Benefit Bullets

Configuration: COMPLEX

The complex configuration allows for advanced functionality and customization, making this product suitable for specialized applications requiring intricate sensor technology.

Size: 10.16 mm

The compact size of the sensor enables easy integration into various devices and systems without taking up much space, ideal for applications where size constraints are a concern.

Optoelectronic Type: LINEAR OUTPUT PHOTO IC

The linear output of this photo IC sensor provides a direct and proportional response to light intensity, offering accurate and consistent measurement results for precise control and monitoring purposes.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement ensures efficient power consumption, making this sensor energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this sensor can withstand elevated environmental conditions, ensuring reliable performance even in potentially harsh or hot industrial environments.

Shape: RECTANGULAR

The rectangular shape of the sensor facilitates easy installation and alignment, enhancing user convenience and simplifying the integration process into various equipment or systems.

Minimum Operating Temperature: 0 °C

The sensor's ability to operate at low temperatures ensures versatility and functionality in diverse temperature environments, making it suitable for both indoor and outdoor applications.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5V simplifies integration and compatibility with common power sources and systems, ensuring ease of use and widespread applicability.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers secure and stable installation of the sensor onto PCBs or other surfaces, ensuring reliable performance and durability in demanding operating conditions.

Technical Specifications

Photo IC Sensors TSL401 attributes and parameters. Explore more Photo IC Sensors devices from Texas Instruments

Specs

Application:

GENERAL PURPOSE

Configuration:

COMPLEX

Infrared (IR) Range:

NO

Mounting Feature:

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optoelectronic Type:

Shape:

RECTANGULAR

Size:

10.16 mm

Sub-Category:

Photo ICs

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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