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TSC2111IRGZR

Texas Instruments

TSC2111IRGZR by Texas Instruments

TSC2111IRGZR by Texas Instruments is a square-shaped audio amplifier IC with 48 terminals. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal output power of 0.4W and terminal pitch of 0.5mm, it is ideal for compact audio applications requiring low power consumption.

Median Price

$5.410

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 37,727 parts In-Stock

1+ parts

-

100+ parts

$4.670

1k+ parts

$4.180

10k+ parts

$3.940

37,727

-

$4.670

$4.180

$3.940

DigiKey

USA . 37,727 parts In-Stock

1+ parts

-

100+ parts

$5.410

1k+ parts

-

10k+ parts

-

37,727

-

$5.410

-

-

Verical

USA . 37,500 parts In-Stock

1+ parts

-

100+ parts

$5.838

1k+ parts

$5.225

10k+ parts

$4.925

37,500

-

$5.838

$5.225

$4.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,298 parts In-Stock

1+ parts

$4.940

100+ parts

-

1k+ parts

-

10k+ parts

-

2,298

$4.940

-

-

-

Vyrian

USA . 4,596 parts In-Stock

1+ parts

$5.200

100+ parts

-

1k+ parts

-

10k+ parts

-

4,596

$5.200

-

-

-

DigiKey Marketplace

USA . 37,727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37,727

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

$2.246

100+ parts

-

1k+ parts

$2.750

10k+ parts

-

1,865

$2.246

-

$2.750

-

DigiPath Technology Company

USA . 278 parts In-Stock

1+ parts

$2.474

100+ parts

$2.276

1k+ parts

-

10k+ parts

-

278

$2.474

$2.276

-

-

ChromeModa Solutions

Germany . 4,255 parts In-Stock

1+ parts

$2.524

100+ parts

$2.070

1k+ parts

-

10k+ parts

-

4,255

$2.524

$2.070

-

-

IDEA Electronic Components Group

UK . 965 parts In-Stock

1+ parts

$2.524

100+ parts

-

1k+ parts

$2.272

10k+ parts

-

965

$2.524

-

$2.272

-

Ampacity Inc.

Singapore . 37,438 parts In-Stock

1+ parts

$4.420

100+ parts

-

1k+ parts

-

10k+ parts

-

37,438

$4.420

-

-

-

Corphita

USA . 3,885 parts In-Stock

1+ parts

$4.680

100+ parts

-

1k+ parts

-

10k+ parts

-

3,885

$4.680

-

-

-

Vigor

Singapore . 37,727 parts In-Stock

1+ parts

$4.990

100+ parts

-

1k+ parts

-

10k+ parts

-

37,727

$4.990

-

-

-

A-Z Elektronik GmbH

Germany . 4,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,572

-

-

-

-

Microchip USA

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

174

-

-

-

-

Overview

Experience superior audio quality with the TSC2111IRGZR by Texas Instruments, a top-of-the-line Audio Amplifier that delivers outstanding performance and reliability. Manufactured by the renowned Texas Instruments, this surface mount amplifier is versatile and ideal for a wide range of audio and video applications. With a nominal output power of 0.4W and a compact square package shape, this amplifier offers exceptional value and benefits for customers looking for high-quality sound amplification solutions. Trust Texas Instruments to provide you with the best-in-class audio technology for all your needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and convenient installation on PCBs, saving space and making the product suitable for compact designs.

Package Shape: SQUARE

Square package shape provides a stable mounting platform, enhancing overall durability and reliability of the product.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output and optimal performance in audio applications.

Power Supplies (V): 1.8, 3.3

Supports multiple power supply options, allowing flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 48

With a large number of terminals, this amplifier offers extensive connectivity options for various input and output sources.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers different package styles to suit different application requirements, including heat dissipation capabilities and space-saving designs.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial environments and ensuring reliable performance under varying conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, allowing for use in a wide range of environments and ensuring consistent operation even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent conductivity, resulting in reliable signal transmission and maintaining long-term performance.

Terminal Position: QUAD

Quad terminal position offers improved stability and contact reliability, reducing the risk of signal loss and ensuring consistent audio output.

Nominal Output Power: 0.4 W

Delivers sufficient power output for audio amplification, ensuring clear and distortion-free sound reproduction.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1 mm allows for space-efficient installation in compact electronic devices.

Width: 7 mm

Narrow width facilitates easy integration into tight spaces, making it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 3 V

Operates efficiently at a low minimum supply voltage of 3 V, ensuring compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

High reflow temperature tolerance allows for safe and effective soldering during assembly processes, ensuring product durability and quality.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperatures, ensuring reliable solder joints and secure component attachment during manufacturing.

Length: 7 mm

Compact length of 7 mm enables easy placement on PCBs and contributes to the overall space-saving design of the amplifier.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, meeting stringent performance and reliability standards for operation in demanding environments.

Terminal Form: NO LEAD

No-lead terminal form offers enhanced mechanical strength and solder joint reliability, ensuring long-term durability and secure connectivity.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for precise and compact arrangement of terminals, optimizing board space and facilitating easy assembly.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates moderate sensitivity to moisture, necessitating proper handling and storage to maintain product integrity.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a maximum supply voltage of 3.6 V, ensuring safe operation within specified voltage limits and protecting the amplifier from overvoltage conditions.

Technical Specifications

Audio & Video Amplifiers TSC2111IRGZR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.4 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TSC2111IRGZR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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