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TSC2007EVM-PDK

Texas Instruments

TSC2007EVM-PDK by Texas Instruments

TSC2007EVM-PDK by Texas Instruments is a touch screen sensor evaluation board with I2C interface. It comes in a box package and includes the TSC2007 IC. Ideal for developing touch screen applications, this kit offers unlimited moisture sensitivity level and is categorized under development boards for evaluation purposes.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,751 parts In-Stock

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Vyrian

USA . 3,874 parts In-Stock

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3,874

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Distributors (Availability)

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AZTECH Wire

Italy . 726 parts In-Stock

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$7.106

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726

$7.106

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Semicontronic

India . 1,194 parts In-Stock

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$136.100

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$132.698

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$132.017

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$136.100

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One Stop Electronics

USA . 662 parts In-Stock

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$160.100

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662

$160.100

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Ampacity Inc.

Singapore . 145 parts In-Stock

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$205.100

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145

$205.100

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ChromeModa Solutions

Germany . 5,427 parts In-Stock

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Corphita

USA . 3,995 parts In-Stock

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

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Parana Technologies

USA . 1,786 parts In-Stock

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$1.195

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DigiPath Technology Company

USA . 1,006 parts In-Stock

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Corohmni

South Africa . 321 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of touch screen technology with the TSC2007EVM-PDK by Texas Instruments. As a trusted industry leader, Texas Instruments delivers unparalleled quality and reliability in their products. The TSC2007EVM-PDK is perfect for a wide range of applications, from consumer electronics to industrial controls. Experience seamless integration with its I2C interface and innovative sensor technology. This versatile evaluation board offers unmatched value and benefits, making it the ideal choice for your development needs. Elevate your projects with the TSC2007EVM-PDK and discover the endless possibilities at your fingertips.

Feature Benefit Bullets

Other Names: TSC2007EVMPDK, 296-31319

Provides easy identification and ordering for the product.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Sensor Evaluation Boards

Indicates the specific purpose and use case of the product for easy integration into projects.

Package: Box

Ensures safe storage and transportation of the product.

Sensor Type: Touch Screen

Enables touch input functionality, ideal for interactive applications.

Interface: I2C

Allows for easy communication with other devices, enhancing connectivity and interoperability.

Supplied Contents: Board(s)

Includes necessary components for evaluation and testing out of the box.

Utilized IC / Part: TSC2007

Utilizes a specific integrated circuit optimized for touch screen applications, ensuring reliable performance.

Base Product Number: TSC2007

Provides a clear reference for compatibility and compatibility with related products or components.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Indicates the product can withstand exposure to a variety of environments without degradation, increasing its durability and versatility.

Technical Specifications

Additional Parts TSC2007EVM-PDK attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TSC2007EVMPDK
296-31319
TSC2007EVM-PDK-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Touch Screen

Supplied Contents:

Board(s)

Utilized IC / Part:

TSC2007

Package:

Box

Embedded:

No

Interface:

I2C

Standard Package:

1

Base Product Number:

TSC2007

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TSC2007EVM-PDK Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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