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TSC2003IPWT

Texas Instruments

TSC2003IPWT by Texas Instruments

TSC2003IPWT by Texas Instruments is a 12-bit ADC with 0.0977% EL, 2 analog in channels, and 0.05 MHz sample rate. Ideal for industrial applications, it operates b/w -40 to 85 °C with a max analog input voltage of 5.25 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,880 parts In-Stock

1+ parts

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3,880

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Digiode

USA . 2,819 parts In-Stock

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2,819

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$6.298

100+ parts

-

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392

$6.298

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Parana Technologies

USA . 155 parts In-Stock

1+ parts

$12.739

100+ parts

-

1k+ parts

$13.204

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155

$12.739

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$13.204

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ChromeModa Solutions

Germany . 2,223 parts In-Stock

1+ parts

$14.313

100+ parts

$11.737

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2,223

$14.313

$11.737

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

1+ parts

$14.313

100+ parts

$13.597

1k+ parts

$12.882

10k+ parts

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1,533

$14.313

$13.597

$12.882

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One Stop Electronics

USA . 972 parts In-Stock

1+ parts

$21.000

100+ parts

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972

$21.000

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Corphita

USA . 2,483 parts In-Stock

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2,483

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DigiPath Technology Company

USA . 779 parts In-Stock

1+ parts

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$12.905

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779

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$12.905

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Overview

Discover the unparalleled quality of the TSC2003IPWT by Texas Instruments, a cutting-edge Analog-to-Digital Converter that redefines precision and reliability. Manufactured by industry leader Texas Instruments, this product offers unparalleled performance with its 12-bit resolution and minimal linearity error. Ideal for a wide range of applications, from industrial automation to consumer electronics, this ADC ensures accurate conversion of analog signals into digital data. Experience the value and benefits of seamless integration, compact design, and exceptional performance with the TSC2003IPWT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and resistance to external elements, making the product suitable for various application environments.

No. of Analog In Channels: 2

Allows for multi-channel input, enabling the conversion of signals from multiple sources simultaneously.

Surface Mount: YES

Facilitates easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Bits: 12

Provides a high level of resolution for accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0977 %

Ensures precision and accuracy in signal conversion, resulting in reliable digital output.

No. of Terminals: 16

Offers flexibility in connectivity and compatibility with various systems and devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact design and efficient use of space, ideal for applications with size constraints.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of temperature environments, enhancing versatility and reliability.

Minimum Operating Temperature: -40 °C

Ensures functionality even in extreme temperature conditions, making the product suitable for diverse environments.

Terminal Position: DUAL

Allows for convenient and secure connections, enhancing the overall performance and stability of the product.

Maximum Seated Height: 1.2 mm

Enables low-profile installation, suitable for applications where space is limited or height restrictions apply.

Width: 4.4 mm

Compact dimensions make the product suitable for small-scale applications and tight spaces.

Length: 5 mm

Offers a balance between size and functionality, making the product versatile and adaptable to various setups.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring durability and reliability under challenging conditions.

Maximum Analog Input Voltage: 5.25 V

Supports a wide range of input voltages, making the product compatible with different signal sources.

Sample Rate: 0.05 MHz

Provides fast and efficient signal conversion, crucial for real-time data acquisition and processing.

Technology: CMOS

Features advanced CMOS technology for low power consumption and high-speed operation, enhancing overall performance.

Terminal Form: GULL WING

Facilitates easy soldering and secure connections, ensuring robust electrical connections in various applications.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes a reliable and precise conversion method for accurate analog-to-digital conversion, ensuring high-quality digital output.

Nominal Supply Voltage: 2.7 V

Operates efficiently within a specific voltage range, ensuring optimal performance and reliability.

Output Bit Code: BINARY

Produces binary output format, compatible with digital systems and data processing applications.

Terminal Pitch: 0.65 mm

Ensures compatibility with standard PCB layouts and facilitates easy integration into existing circuits.

Minimum Analog Input Voltage: 0 V

Supports input signals from ground level, allowing for accurate conversion of a wide range of analog signals.

Output Format: SERIAL

Generates serial data output for efficient data transmission and integration with various digital systems.

Sample and Hold/Track and Hold: SAMPLE

Incorporates sample-and-hold functionality for accurate sampling and conversion of analog signals, ensuring precise digital output.

Technical Specifications

Analog-to-Digital Converters TSC2003IPWT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

50 kHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

2.7 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

Trade Compliance

TSC2003IPWT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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