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TSC2003I

Texas Instruments

TSC2003I by Texas Instruments

TSC2003I by Texas Instruments is a 12-bit ADC with 3 analog in channels, 0.0977% max linearity error, and 0.05 us conversion time. Ideal for industrial applications, it operates b/w -40 to 85 °C with a max analog input voltage of 2.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,926 parts In-Stock

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Digiode

USA . 764 parts In-Stock

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Cyclops Electronics Ltd

UK . 26 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,149 parts In-Stock

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$10.118

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$10.664

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$10.118

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DigiPath Technology Company

USA . 2,309 parts In-Stock

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$11.141

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$11.141

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ChromeModa Solutions

Germany . 3,950 parts In-Stock

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$11.368

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$9.322

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$11.368

$9.322

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IDEA Electronic Components Group

UK . 724 parts In-Stock

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$11.368

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$10.800

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$10.231

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724

$11.368

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$10.231

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AZTECH Wire

Italy . 857 parts In-Stock

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$19.527

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857

$19.527

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One Stop Electronics

USA . 1,225 parts In-Stock

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$38.000

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Corphita

USA . 4,233 parts In-Stock

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Kepictronics

USA . 136 parts In-Stock

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Overview

Unlock the power of precision with the TSC2003I analog-to-digital converter by Texas Instruments. Crafted with unparalleled quality and expertise, this device offers a seamless conversion experience for your projects. With three analog input channels and 12 bits resolution, this compact package provides accuracy and efficiency in a wide range of applications. From industrial automation to consumer electronics, the TSC2003I delivers value and reliability, ensuring optimal performance every time. Experience the advantages of cutting-edge technology with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the converter, making it suitable for various environmental conditions.

No. of Analog In Channels: 3

Having 3 analog input channels allows for multiple input signals to be converted simultaneously, increasing efficiency and versatility.

Surface Mount: YES

Surface mount capability makes installation and integration of the converter onto a circuit board easy and convenient.

Maximum Linearity Error (EL): 0.0977 %

Low linearity error ensures accurate conversion of analog input signals into digital values, leading to precise output data.

No. of Bits: 12

With 12 bits of resolution, the converter can provide detailed and accurate digital representation of the analog input signals.

Maximum Conversion Time: 0.05 us

Fast conversion time ensures real-time responsiveness and high-speed operation of the converter.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the converter efficient and reliable for various applications.

Output Format: SERIAL

Serial output format enables easy interface with other digital systems and devices, simplifying communication and data transfer.

Technical Specifications

Analog-to-Digital Converters TSC2003I attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

3

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Hold Mode:

Sample

Maximum Conversion Time:

50 ns

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.5 V

Nominal Supply Voltage:

2.7 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

Trade Compliance

TSC2003I Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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