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TSB82AF15QPZTEP

Texas Instruments

TSB82AF15QPZTEP by Texas Instruments

TSB82AF15QPZTEP by Texas Instruments is an Interface IC with 100 terminals, operating at -40 to 105°C. It has a supply voltage range of 1.4-1.6V and comes in a square-shaped flatpack package suitable for industrial applications requiring fine pitch interface circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,732 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,732

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-

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Digiode

USA . 2,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,192 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

$4.248

10k+ parts

-

2,192

$3.750

-

$4.248

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DigiPath Technology Company

USA . 1,178 parts In-Stock

1+ parts

$4.130

100+ parts

-

1k+ parts

-

10k+ parts

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1,178

$4.130

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IDEA Electronic Components Group

UK . 2,132 parts In-Stock

1+ parts

$4.214

100+ parts

-

1k+ parts

$3.793

10k+ parts

-

2,132

$4.214

-

$3.793

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ChromeModa Solutions

Germany . 606 parts In-Stock

1+ parts

$4.214

100+ parts

$3.455

1k+ parts

-

10k+ parts

-

606

$4.214

$3.455

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AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$15.158

100+ parts

-

1k+ parts

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10k+ parts

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878

$15.158

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One Stop Electronics

USA . 1,637 parts In-Stock

1+ parts

$16.500

100+ parts

-

1k+ parts

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10k+ parts

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1,637

$16.500

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Corphita

USA . 4,858 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,858

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Overview

Enhance your electronic designs with the TSB82AF15QPZTEP by Texas Instruments. Manufactured with precision and quality in mind, this Interface IC offers a multitude of applications in various industries. From its durable plastic/epoxy package body material to its cutting-edge design, this product provides unmatched value and benefits to customers. Experience seamless integration, reliable performance, and enhanced functionality with the TSB82AF15QPZTEP - the perfect choice for all your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to heat, making this product suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 1.6 V

The high maximum supply voltage of 1.6V provides flexibility in power input options.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards.

No. of Terminals: 100

With 100 terminals, this product offers a versatile range of connectivity options.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch design of the package make it suitable for compact electronic devices.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage of 1.4V ensures efficient power consumption.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows for reliable performance in varying environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures this product can withstand extreme cold conditions.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections for enhanced reliability.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm helps in saving space in compact electronic designs.

Width: 14 mm

The width of 14mm makes this product suitable for applications where space is limited.

Length: 14 mm

The length of 14mm ensures a compact form factor for easy integration into electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and reliable electrical connections.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5V ensures stable and efficient power operation.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product offers high-density packaging and precise connections.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit type allows for seamless communication between different electronic components, enhancing overall system functionality.

Technical Specifications

Other Function Interface ICs TSB82AF15QPZTEP attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TSB82AF15QPZTEP Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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