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TSB15LV01PFCG4

Texas Instruments

TSB15LV01PFCG4 by Texas Instruments

TSB15LV01PFCG4 by Texas Instruments is a consumer IC with 80 terminals in a square flatpack package. Operating b/w 0-70°C, it uses CMOS technology and has a peak reflow temperature of 260°C. Ideal for various consumer circuit applications due to its thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,051 parts In-Stock

1+ parts

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8,051

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Digiode

USA . 3,392 parts In-Stock

1+ parts

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3,392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 210 parts In-Stock

1+ parts

$1.775

100+ parts

-

1k+ parts

$2.340

10k+ parts

-

210

$1.775

-

$2.340

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ChromeModa Solutions

Germany . 2,061 parts In-Stock

1+ parts

$1.994

100+ parts

$1.635

1k+ parts

-

10k+ parts

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2,061

$1.994

$1.635

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IDEA Electronic Components Group

UK . 1,251 parts In-Stock

1+ parts

$1.994

100+ parts

-

1k+ parts

$1.795

10k+ parts

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1,251

$1.994

-

$1.795

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One Stop Electronics

USA . 145 parts In-Stock

1+ parts

$7.800

100+ parts

-

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145

$7.800

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AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$13.819

100+ parts

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524

$13.819

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DigiPath Technology Company

USA . 2,267 parts In-Stock

1+ parts

-

100+ parts

$1.798

1k+ parts

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10k+ parts

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2,267

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$1.798

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Microchip USA

USA . 461 parts In-Stock

1+ parts

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461

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Corphita

USA . 69 parts In-Stock

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69

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Overview

Discover the unmatched quality and reliability of the TSB15LV01PFCG4 by Texas Instruments, a leading manufacturer in the electronics industry. This versatile consumer IC offers a wide range of applications, providing exceptional value and benefits to customers. With its advanced technology and innovative design, this product ensures optimal performance and efficiency in various electronic devices. Experience the advantages of Texas Instruments' expertise and trust in the TSB15LV01PFCG4 for all your circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers good protection against environmental factors and ensures durability.

Surface Mount: YES

Surface mount technology makes the product easier to assemble and reduces overall size and weight.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and efficiency in consumer electronics.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function Consumer ICs TSB15LV01PFCG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TSB15LV01PFCG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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