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TRSF3243CDWG4

Texas Instruments

TRSF3243CDWG4 by Texas Instruments

TRSF3243CDWG4 by Texas Instruments is a Line Driver & Receiver with 5 functions, operating at 3.3/5V. It has EIA-232 interface standard, Schmitt trigger input characteristics, and Gull Wing terminal form. Ideal for commercial applications requiring high-speed data transmission in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,543 parts In-Stock

1+ parts

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7,543

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Digiode

USA . 1,438 parts In-Stock

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1,438

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,078 parts In-Stock

1+ parts

$10.769

100+ parts

-

1k+ parts

$11.252

10k+ parts

-

1,078

$10.769

-

$11.252

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IDEA Electronic Components Group

UK . 965 parts In-Stock

1+ parts

$12.100

100+ parts

$11.495

1k+ parts

$10.890

10k+ parts

-

965

$12.100

$11.495

$10.890

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ChromeModa Solutions

Germany . 527 parts In-Stock

1+ parts

$12.100

100+ parts

$9.922

1k+ parts

-

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527

$12.100

$9.922

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AZTECH Wire

Italy . 219 parts In-Stock

1+ parts

$15.512

100+ parts

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219

$15.512

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One Stop Electronics

USA . 1,381 parts In-Stock

1+ parts

$21.500

100+ parts

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1,381

$21.500

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Corphita

USA . 2,204 parts In-Stock

1+ parts

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2,204

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DigiPath Technology Company

USA . 907 parts In-Stock

1+ parts

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100+ parts

$10.909

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907

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$10.909

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Microchip USA

USA . 285 parts In-Stock

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285

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Overview

Experience unparalleled quality and innovation with the TRSF3243CDWG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch products that exceed expectations. The TRSF3243CDWG4 falls under the category of Line Drivers & Receivers, offering reliability and versatility for various applications. With its small outline package style and dual terminal position, this product provides convenience and efficiency. Trust Texas Instruments to provide cutting-edge technology that enhances your projects, making the TRSF3243CDWG4 the ideal choice for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Supply Voltage: 3.6 V

Ability to handle high voltage inputs makes this product versatile and suitable for a wide range of applications.

No. of Functions: 5

Multiple functions in one device offer cost-effective solution and reduces the need for additional components.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments, enhancing reliability in various conditions.

Width: 7.5 mm

Compact size allows for easy integration into tight spaces or crowded PCB layouts.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input ensures accurate switching between high and low states, improving signal integrity.

Technical Specifications

Line Drivers & Receivers TRSF3243CDWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TRSF3243CDWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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