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TRSF3243CDB

Texas Instruments

TRSF3243CDB by Texas Instruments

TRSF3243CDB by Texas Instruments is a Line Driver & Receiver with 5 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and Gull Wing terminal form. Ideal for commercial applications requiring reliable data transmission in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,937 parts In-Stock

1+ parts

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4,937

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Vyrian

USA . 2,898 parts In-Stock

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2,898

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,394 parts In-Stock

1+ parts

$3.500

100+ parts

-

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1,394

$3.500

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Parana Technologies

USA . 690 parts In-Stock

1+ parts

$13.037

100+ parts

-

1k+ parts

$13.531

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-

690

$13.037

-

$13.531

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ChromeModa Solutions

Germany . 1,759 parts In-Stock

1+ parts

$14.648

100+ parts

$12.011

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1,759

$14.648

$12.011

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$14.648

100+ parts

$13.916

1k+ parts

$13.183

10k+ parts

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1,078

$14.648

$13.916

$13.183

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AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$19.353

100+ parts

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799

$19.353

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Component Stockers USA

USA . 357 parts In-Stock

1+ parts

$99.990

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357

$99.990

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Corphita

USA . 4,327 parts In-Stock

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4,327

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DigiPath Technology Company

USA . 2,354 parts In-Stock

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$13.207

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2,354

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$13.207

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Microchip USA

USA . 209 parts In-Stock

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209

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Kepictronics

USA . 190 parts In-Stock

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190

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the TRSF3243CDB Line Driver & Receiver. This versatile product offers unparalleled performance across a range of applications, providing customers with value and benefits that are unmatched in the industry. With its advanced design and innovative features, the TRSF3243CDB is the ideal choice for those seeking a high-quality solution for their electronic needs. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Easier installation and space-saving design for more compact electronic devices.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power supplies.

No. of Functions: 5

Provides multiple functionalities in a single component, reducing the need for additional components.

Package Shape: RECTANGULAR

Simplifies integration into circuit designs and PCB layouts.

Power Supplies (V): 3.3/5

Offers flexibility in powering options for different applications.

No. of Terminals: 28

Sufficient connection points for versatile setups and configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Space-efficient design for more compact and dense circuit assemblies.

Maximum High Level Input Current: 0.000001 Amp

Efficient and low power consumption operation.

Minimum Supply Voltage: 3 V

Ensures stable performance within the specified voltage range.

Maximum Operating Temperature: 70 °C

Suitable for use in a wide range of operating environments.

Minimum Operating Temperature: 0 °C

Designed to work reliably even in low-temperature conditions.

Terminal Position: DUAL

Enables easy connection and setup in various circuit configurations.

Maximum Seated Height: 2 mm

Low-profile design for space-constrained applications.

Width: 5.3 mm

Compact form factor for efficient PCB layout and space utilization.

Maximum Output Low Current: 1.6 Amp

Capable of driving output loads with high current requirements.

Receiver No. of Bits: 5

Provides precision and accuracy in signal reception and processing.

Length: 10.2 mm

Optimal size for fitting into various electronic devices and systems.

Minimum Out Swing: 10 V

Ensures compatibility with a wide range of output signal levels.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications and environments.

Maximum Receive Delay: 0 ns

Provides instantaneous data reception and processing.

Terminal Form: GULL WING

Facilitates easy soldering and connection in surface mount applications.

Interface Standard: EIA-232

Compliance with industry standards for seamless integration and compatibility.

Maximum Supply Current: 1 mA

Efficient power consumption for energy-efficient operation.

Input Characteristics: SCHMITT TRIGGER

Provides noise immunity and signal stability for reliable operation.

Nominal Supply Voltage: 3.3 V

Standard and compatible supply voltage for various applications.

Terminal Pitch: 0.65 mm

Fine pitch spacing for compact and high-density PCB designs.

Driver No. of Bits: 3

Optimal resolution and accuracy in signal transmission.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for efficient communication and signal transmission in line driver and receiver applications.

Technical Specifications

Line Drivers & Receivers TRSF3243CDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3243CDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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