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TRSF3238IDBR

Texas Instruments

TRSF3238IDBR by Texas Instruments

TRSF3238IDBR by Texas Instruments is a 28-terminal line driver with 5 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and industrial temperature grade. Ideal for applications requiring high-speed data transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,601 parts In-Stock

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Digiode

USA . 187 parts In-Stock

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187

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Distributors (Availability)

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AZTECH Wire

Italy . 778 parts In-Stock

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$8.139

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778

$8.139

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Parana Technologies

USA . 1,776 parts In-Stock

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$8.262

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$8.877

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$8.262

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$8.877

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DigiPath Technology Company

USA . 1,817 parts In-Stock

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$9.097

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$8.370

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$9.097

$8.370

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ChromeModa Solutions

Germany . 4,926 parts In-Stock

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$9.283

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$7.612

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4,926

$9.283

$7.612

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IDEA Electronic Components Group

UK . 1,134 parts In-Stock

1+ parts

$9.283

100+ parts

$8.819

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$8.355

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1,134

$9.283

$8.819

$8.355

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One Stop Electronics

USA . 137 parts In-Stock

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$17.500

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137

$17.500

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Corphita

USA . 2,563 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,203 parts In-Stock

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Microchip USA

USA . 171 parts In-Stock

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Overview

Elevate your electronics with the TRSF3238IDBR by Texas Instruments, a top-of-the-line Line Driver & Receiver that brings unparalleled quality and reliability to your projects. With a manufacturer like Texas Instruments at the helm, you can trust in the superior performance and cutting-edge technology of this product. This versatile device is perfect for a wide range of applications, offering customers unmatched value and benefits. Experience seamless connectivity and enhanced functionality with the TRSF3238IDBR - your go-to solution for all your line driving and receiving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage enables compatibility with a wide range of systems and applications.

No. of Functions: 5

Having multiple functions in a single package reduces the need for additional components, simplifying design and saving space.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on PCBs and easy mounting in various enclosures.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages offers flexibility in system design and compatibility with different power sources.

No. of Terminals: 28

Plenty of terminals provide connectivity options for various inputs and outputs, allowing for versatile usage.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch packaging save space on the PCB, making it ideal for compact designs.

Maximum High Level Input Current: 0.000001 Amp

The low input current requirement helps in reducing power consumption and improving efficiency.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in harsh environments or industrial settings.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the product can function in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connecting to external devices.

Maximum Seated Height: 2 mm

Low seated height facilitates compact designs and allows for the product to fit in tight spaces.

Width: 5.3 mm

Narrow width makes the product suitable for applications where space is limited.

Maximum Output Low Current: 1.6 Amp

High maximum low output current capability ensures compatibility with a wide range of loads.

Receiver No. of Bits: 3

The receiver with 3 bits provides sufficient resolution for receiving and interpreting signals accurately.

Length: 10.2 mm

Compact length makes the product suitable for applications where space is constrained.

Minimum Out Swing: 10 V

Wide minimum output swing range enables compatibility with different input signal levels.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environments.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time transmission and reception of signals.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and easy PCB mounting.

Interface Standard: EIA-232

Compliance with EIA-232 interface standard ensures interoperability with various communication devices and systems.

Maximum Supply Current: 2 mA

Low maximum supply current requirement helps in reducing power consumption and heat generation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics ensure robust signal reception and noise immunity.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density PCB designs and compact integration.

Driver No. of Bits: 5

The driver with 5 bits provides sufficient resolution for transmitting signals accurately.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional data transfer between devices efficiently.

Technical Specifications

Line Drivers & Receivers TRSF3238IDBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3238IDBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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