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TRSF3232EIDB

Texas Instruments

TRSF3232EIDB by Texas Instruments

TRSF3232EIDB by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and dual terminal position. Ideal for industrial applications requiring reliable data transmission in temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,619 parts In-Stock

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4,619

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Digiode

USA . 372 parts In-Stock

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372

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Distributors (Availability)

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Parana Technologies

USA . 1,279 parts In-Stock

1+ parts

$5.126

100+ parts

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$5.716

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1,279

$5.126

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$5.716

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DigiPath Technology Company

USA . 1,515 parts In-Stock

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$5.645

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$5.645

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ChromeModa Solutions

Germany . 2,880 parts In-Stock

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$5.760

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$4.723

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$5.760

$4.723

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IDEA Electronic Components Group

UK . 2,316 parts In-Stock

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$5.760

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$5.184

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$5.760

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$5.184

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AZTECH Wire

Italy . 443 parts In-Stock

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$19.490

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443

$19.490

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One Stop Electronics

USA . 1,611 parts In-Stock

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$36.500

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$36.500

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Ampacity Inc.

Singapore . 1,643 parts In-Stock

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$42.500

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QUARKTWIN TECHNOLOGY LTD

USA . 4,013 parts In-Stock

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Corphita

USA . 876 parts In-Stock

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Microchip USA

USA . 280 parts In-Stock

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280

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Overview

Looking for a reliable line driver and receiver for your project? Look no further than the TRSF3232EIDB by Texas Instruments. With a commitment to quality and innovation, Texas Instruments delivers top-notch products like this one, perfect for applications in various industries. This versatile device offers exceptional value, benefits, and advantages to customers, ensuring seamless connectivity and optimal performance. Trust Texas Instruments for all your line driver and receiver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, making it compatible with a wide range of power sources.

No. of Functions: 2

Dual functionality in a single package provides flexibility and efficiency in circuit design.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and alignment on circuit boards.

Power Supplies (V): 3.3/5

Supports multiple power supply voltages, offering compatibility with different systems.

No. of Terminals: 16

Offers a sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact small outline package with shrink pitch design saves space on the circuit board.

Maximum High Level Input Current: 0.000001 Amp

Low high level input current ensures efficient power consumption and signal processing.

Minimum Supply Voltage: 3 V

Works efficiently even at low supply voltages, ensuring stable operation in various conditions.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments, providing versatility in operating conditions.

Terminal Position: DUAL

Dual terminal position allows for flexibility in component orientation during installation.

Maximum Seated Height: 2 mm

Low seated height makes the component suitable for compact and slim designs.

Width: 5.3 mm

Narrow width enables space-saving placement on the circuit board.

Maximum Output Low Current: 1.6 Amp

Supports a high output low current for efficient signal transmission and power delivery.

Receiver No. of Bits: 2

Two receiver bits provide accurate and reliable data reception in communication systems.

Length: 6.2 mm

Compact length allows for efficient use of space on the circuit board.

Minimum Out Swing: 10 V

Minimum out swing of 10V ensures robust signal output for communication purposes.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring long-term reliability.

Maximum Receive Delay: 0 ns

Zero receive delay ensures immediate response to incoming signals for real-time applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections to the circuit board.

Interface Standard: EIA-232

Compliant with EIA-232 standard for reliable communication interfaces.

Maximum Supply Current: 1 mA

Low maximum supply current for efficient power consumption in operation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics for improved noise immunity and signal stability.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable operation and compatibility with common power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm for precise and compact connections on the circuit board.

Driver No. of Bits: 2

Two driver bits provide accurate and reliable data transmission in communication systems.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type for efficient data exchange and communication protocols.

Technical Specifications

Line Drivers & Receivers TRSF3232EIDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3232EIDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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