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TRSF3232ECDWG4

Texas Instruments

TRSF3232ECDWG4 by Texas Instruments

TRSF3232ECDWG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 16 terminals, and 1mA max supply current. It operates in commercial temperature range of 0-70°C and uses EIA-232 interface standard for communication applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,571 parts In-Stock

1+ parts

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7,571

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Digiode

USA . 3,470 parts In-Stock

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-

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3,470

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 185 parts In-Stock

1+ parts

$8.034

100+ parts

-

1k+ parts

$8.616

10k+ parts

-

185

$8.034

-

$8.616

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ChromeModa Solutions

Germany . 2,942 parts In-Stock

1+ parts

$9.027

100+ parts

$7.402

1k+ parts

-

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2,942

$9.027

$7.402

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$9.027

100+ parts

$8.576

1k+ parts

$8.124

10k+ parts

-

893

$9.027

$8.576

$8.124

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AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$15.156

100+ parts

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247

$15.156

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One Stop Electronics

USA . 206 parts In-Stock

1+ parts

$31.500

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206

$31.500

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Corphita

USA . 3,067 parts In-Stock

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3,067

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DigiPath Technology Company

USA . 555 parts In-Stock

1+ parts

-

100+ parts

$8.139

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555

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$8.139

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Microchip USA

USA . 253 parts In-Stock

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253

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Overview

Discover the TRSF3232ECDWG4 by Texas Instruments, a cutting-edge line driver & receiver that offers exceptional quality and reliability. With its advanced technology and durable construction, this product is perfect for a wide range of applications. Whether you're looking to enhance your communication systems or improve data transmission, the TRSF3232ECDWG4 delivers outstanding performance every time. Trust in Texas Instruments' reputation for excellence and experience the value and benefits that this product brings to your projects. Upgrade your electronics with the TRSF3232ECDWG4 today!

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage options, making the product versatile and compatible with different systems.

Power Supplies (V): 3.3/5

Can operate on both 3.3V and 5V power supplies, offering flexibility in powering the device.

Maximum Output Low Current: 1.6 Amp

Capable of driving high current loads, which is essential for reliable and efficient signal transmission.

Interface Standard: EIA-232

Complies with industry standards, ensuring compatibility with a wide range of devices and systems.

Input Characteristics: SCHMITT TRIGGER

Utilizes Schmitt trigger input for noise immunity, ensuring reliable data transmission in noisy environments.

Technical Specifications

Line Drivers & Receivers TRSF3232ECDWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TRSF3232ECDWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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