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TRSF3232CDWR

Texas Instruments

TRSF3232CDWR by Texas Instruments

TRSF3232CDWR by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and dual functions for versatile applications in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,964 parts In-Stock

1+ parts

-

100+ parts

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6,964

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Digiode

USA . 3,748 parts In-Stock

1+ parts

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3,748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 211 parts In-Stock

1+ parts

$3.629

100+ parts

-

1k+ parts

$4.141

10k+ parts

-

211

$3.629

-

$4.141

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DigiPath Technology Company

USA . 2,088 parts In-Stock

1+ parts

$3.996

100+ parts

$3.677

1k+ parts

-

10k+ parts

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2,088

$3.996

$3.677

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ChromeModa Solutions

Germany . 6,876 parts In-Stock

1+ parts

$4.078

100+ parts

$3.344

1k+ parts

-

10k+ parts

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6,876

$4.078

$3.344

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IDEA Electronic Components Group

UK . 162 parts In-Stock

1+ parts

$4.078

100+ parts

-

1k+ parts

$3.670

10k+ parts

-

162

$4.078

-

$3.670

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AZTECH Wire

Italy . 780 parts In-Stock

1+ parts

$9.334

100+ parts

-

1k+ parts

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10k+ parts

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780

$9.334

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One Stop Electronics

USA . 432 parts In-Stock

1+ parts

$48.500

100+ parts

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432

$48.500

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Corphita

USA . 2,545 parts In-Stock

1+ parts

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2,545

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A-Z Elektronik GmbH

Germany . 2,069 parts In-Stock

1+ parts

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2,069

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Microchip USA

USA . 173 parts In-Stock

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173

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Overview

Enhance your communication systems with the TRSF3232CDWR by Texas Instruments, a top-of-the-line Line Driver & Receiver. Crafted with precision and expertise, this product offers unmatched reliability and performance. Whether you're in need of seamless data transmission or efficient signal processing, this versatile device has got you covered. Trust in Texas Instruments' reputation for excellence and elevate your electronics to the next level. Experience enhanced connectivity and productivity with the TRSF3232CDWR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving in electronic circuit designs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle power fluctuations and operate reliably within the specified range.

No. of Functions: 2

Having multiple functions in one component offers flexibility and efficiency in circuit design and implementation.

Package Shape: RECTANGULAR

The rectangular package shape simplifies the integration of the product into circuit layouts and ensures a compact design.

Power Supplies (V): 3.3/5

Compatible with multiple power supply voltages, offering versatility and compatibility in different electronic systems.

No. of Terminals: 16

With a sufficient number of terminals, the product can support complex connections and functionalities in circuit applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for denser and more compact designs.

Maximum High Level Input Current: 0.000001 Amp

The low input current requirement minimizes power consumption and reduces the heat dissipation of the product.

Minimum Supply Voltage: 3 V

The product can operate at a low supply voltage, making it suitable for battery-powered devices and energy-efficient applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: 0 °C

The product can operate in cold temperatures, ensuring functionality in various temperature settings.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting the product within a circuit and allows for different wiring configurations.

Maximum Seated Height: 2.65 mm

The low seated height allows for a slim and streamlined design, ideal for space-constrained applications.

Width: 7.5 mm

The compact width of the product enables efficient use of space on circuit boards and facilitates board layout designs.

Maximum Output Low Current: 1.6 Amp

The high output current capacity enables the product to drive external devices with sufficient power, ensuring reliable operation.

Receiver No. of Bits: 2

The two bits receiver configuration allows for effective data reception and processing in communication systems.

Length: 10.3 mm

The moderate length of the product facilitates easy integration into circuit layouts and ensures compatibility with standard board sizes.

Minimum Out Swing: 10 V

The minimum output swing value ensures proper signal transmission and reception in communication applications.

Temperature Grade: COMMERCIAL

The commercial-grade temperature rating indicates that the product meets industry standards for reliability and performance in typical operating conditions.

Maximum Receive Delay: 0 ns

The zero nanosecond receive delay ensures real-time data transfer and minimizes latency in communication systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies and secures the soldering process during assembly, ensuring reliable connections.

Interface Standard: EIA-232

The EIA-232 interface standard ensures compatibility with a widely adopted communication protocol, facilitating seamless integration into existing systems.

Maximum Supply Current: 1 mA

The low maximum supply current requirement helps reduce power consumption and extends the product's operational lifespan.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics ensure stable and noise-immune signal processing, enhancing the product's reliability in noisy environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides a stable operating voltage for the product, ensuring consistent performance in electronic systems.

Terminal Pitch: 1.27 mm

The compact terminal pitch allows for high-density mounting on circuit boards, improving the overall efficiency of circuit design.

Driver No. of Bits: 2

The two bits driver configuration enables efficient data transmission and control in communication systems, enhancing overall system performance.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, the product can interface between different communication lines, facilitating data exchange between various devices and systems.

Technical Specifications

Line Drivers & Receivers TRSF3232CDWR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATED AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TRSF3232CDWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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