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TRSF3232CDB

Texas Instruments

TRSF3232CDB by Texas Instruments

TRSF3232CDB by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and dual terminal position. Ideal for commercial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,234 parts In-Stock

1+ parts

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6,234

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Digiode

USA . 705 parts In-Stock

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705

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,079 parts In-Stock

1+ parts

$7.795

100+ parts

-

1k+ parts

$8.342

10k+ parts

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1,079

$7.795

-

$8.342

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DigiPath Technology Company

USA . 1,271 parts In-Stock

1+ parts

$8.583

100+ parts

-

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1,271

$8.583

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ChromeModa Solutions

Germany . 2,344 parts In-Stock

1+ parts

$8.758

100+ parts

$7.182

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-

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2,344

$8.758

$7.182

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IDEA Electronic Components Group

UK . 782 parts In-Stock

1+ parts

$8.758

100+ parts

$8.320

1k+ parts

$7.882

10k+ parts

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782

$8.758

$8.320

$7.882

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AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$19.409

100+ parts

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435

$19.409

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One Stop Electronics

USA . 984 parts In-Stock

1+ parts

$29.500

100+ parts

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984

$29.500

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Corphita

USA . 732 parts In-Stock

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732

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Microchip USA

USA . 124 parts In-Stock

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124

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Overview

Enhance the performance and reliability of your electronic systems with the TRSF3232CDB by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that are essential for various applications. This product offers unparalleled value to customers by providing stable power supplies, high-level input currents, and wide temperature tolerances. With its compact design and advanced features, the TRSF3232CDB is the perfect solution for optimizing your electronic circuits. Upgrade your systems today with Texas Instruments' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and provide good protection for the internal components of the product, ensuring longevity and reliability.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time during the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power sources and compatibility with a variety of systems.

No. of Functions: 2

Having multiple functions in one product can help save space on a circuit board and simplify overall system design.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and arrangement on a circuit board, optimizing space utilization.

Power Supplies (V): 3.3/5

The product supports multiple power supply options, providing versatility for different applications and environments.

No. of Terminals: 16

The high number of terminals allows for multiple connections, enabling the product to effectively transmit and receive signals.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This compact package style saves space on the circuit board, making it ideal for devices with size constraints.

Maximum High Level Input Current: 0.000001 Amp

This low input current helps in reducing power consumption and heat generation, leading to improved efficiency.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures operation in a wide range of applications and environments, enhancing versatility.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature enables the product to perform reliably in various conditions, including industrial settings.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in cold environments, making the product suitable for diverse applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connection options, accommodating different circuit board layouts and designs.

Maximum Seated Height: 2 mm

The low seated height allows for a compact design, making the product suitable for space-constrained applications.

Width: 5.3 mm

The narrow width of the product enables efficient use of space on a circuit board, optimizing layout and design.

Maximum Output Low Current: 1.6 Amp

The high maximum output current capability ensures reliable signal transmission and reception, even in demanding applications.

Receiver No. of Bits: 2

Having multiple bits in the receiver enhances the accuracy and precision of data transmission, ensuring reliable communication.

Length: 6.2 mm

The compact length of the product contributes to efficient use of space on a circuit board, ideal for compact devices.

Minimum Out Swing: 10 V

The minimum output swing of 10V ensures robust signal transmission and reception, even in noisy environments.

Temperature Grade: COMMERCIAL

The commercial-grade temperature tolerance ensures reliability and performance in standard operating conditions, suitable for a wide range of applications.

Maximum Receive Delay: 0 ns

The zero receive delay ensures real-time signal transmission and reception, crucial for applications that require instantaneous communication.

Terminal Form: GULL WING

The gull wing terminal form provides secure connectivity and easy installation on a circuit board, enhancing reliability and ease of use.

Interface Standard: EIA-232

Compliance with the EIA-232 interface standard ensures compatibility and seamless integration with existing systems and devices following the same standard.

Maximum Supply Current: 1 mA

The low maximum supply current requirement helps in reducing power consumption, leading to energy efficiency and extended operational lifespan.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and signal stabilization, ensuring reliable operation in noisy environments where signal integrity is crucial.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V offers compatibility with common power sources, making it suitable for a wide range of applications.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for compact layout and efficient use of space on a circuit board, contributing to a streamlined design.

Driver No. of Bits: 2

Having multiple bits in the driver enhances the precision and accuracy of signal transmission, ensuring reliable data transfer.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional signal transmission and reception, facilitating communication between different devices effectively.

Technical Specifications

Line Drivers & Receivers TRSF3232CDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATED AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3232CDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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