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TRSF3223IDWG4

Texas Instruments

TRSF3223IDWG4 by Texas Instruments

TRSF3223IDWG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and industrial temperature grade. Ideal for applications requiring reliable data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,875

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-

-

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Digiode

USA . 1,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,407

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 153 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

153

$2.500

-

-

-

Parana Technologies

USA . 1,198 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

$3.762

10k+ parts

-

1,198

$3.240

-

$3.762

-

ChromeModa Solutions

Germany . 4,971 parts In-Stock

1+ parts

$3.641

100+ parts

$2.986

1k+ parts

-

10k+ parts

-

4,971

$3.641

$2.986

-

-

IDEA Electronic Components Group

UK . 1,717 parts In-Stock

1+ parts

$3.641

100+ parts

-

1k+ parts

$3.277

10k+ parts

-

1,717

$3.641

-

$3.277

-

One Stop Electronics

USA . 690 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

-

10k+ parts

-

690

$7.500

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$10.539

100+ parts

$9.590

1k+ parts

$8.642

10k+ parts

-

500

$10.539

$9.590

$8.642

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AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$14.356

100+ parts

-

1k+ parts

-

10k+ parts

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846

$14.356

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-

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Semicontronic

India . 498 parts In-Stock

1+ parts

$44.500

100+ parts

$43.388

1k+ parts

$43.165

10k+ parts

-

498

$44.500

$43.388

$43.165

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DigiPath Technology Company

USA . 1,265 parts In-Stock

1+ parts

-

100+ parts

$3.283

1k+ parts

-

10k+ parts

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1,265

-

$3.283

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Corphita

USA . 704 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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704

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Corohmni

South Africa . 364 parts In-Stock

1+ parts

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100+ parts

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364

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Microchip USA

USA . 299 parts In-Stock

1+ parts

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100+ parts

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299

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Overview

Unlock the power of reliable data transmission with the TRSF3223IDWG4 by Texas Instruments. Crafted with precision and expertise, this line driver and receiver offers seamless communication solutions for industrial applications. With a compact design and high-quality materials, this product ensures optimal performance and durability. Experience the value of efficient signal processing and the benefits of smooth operation with the TRSF3223IDWG4. Elevate your projects with trusted technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle a higher voltage range, making it compatible with various power sources and environments.

No. of Functions: 2

Provides versatility and flexibility in terms of functionality, allowing for multiple tasks to be performed efficiently.

Package Shape: RECTANGULAR

Optimal design for space-saving and efficient placement within electronic devices or systems.

Power Supplies (V): 3.3/5

Supports different voltage requirements, ensuring compatibility with a wide range of devices.

No. of Terminals: 20

Sufficient number of terminals for connecting with other components or devices, enabling seamless communication and integration.

Package Style (Meter): SMALL OUTLINE

Compact design for easy integration and space efficiency in electronic applications.

Maximum High Level Input Current: 0.000001 Amp

Efficient power consumption and minimal heat generation for improved overall performance.

Minimum Supply Voltage: 3 V

Works with lower voltage inputs, offering flexibility in power source options.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial or harsh environment applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, making it suitable for a variety of environments.

Terminal Position: DUAL

Provides redundancy and flexibility in connections, ensuring reliability and ease of use.

Maximum Seated Height: 2.65 mm

Low-profile design for space-saving and compact installations.

Width: 7.5 mm

Compact width for easy integration and placement within electronic systems.

Maximum Output Low Current: 1.6 Amp

Capable of delivering sufficient output current for driving external components or devices.

Receiver No. of Bits: 2

Suitable for receiving and processing data in a digital format, supporting efficient communication protocols.

Length: 12.8 mm

Optimal length for compact installations and efficient use of space.

Minimum Out Swing: 10 V

Supports a wide swing range for data transmission, ensuring compatibility with various signal levels.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Maximum Receive Delay: 0 ns

Minimal delay in receiving input signals, ensuring real-time data processing and communication.

Terminal Form: GULL WING

Offers secure and reliable terminal connections for stable operation and data transfer.

Interface Standard: EIA-232

Compliant with industry standards for seamless integration and communication with other devices or systems.

Maximum Supply Current: 1 mA

Low power consumption for energy efficiency and prolonged battery life in portable applications.

Input Characteristics: SCHMITT TRIGGER

Provides noise immunity and signal stability for reliable data transmission and processing.

Nominal Supply Voltage: 3.3 V

Standard voltage rating for compatibility with common power sources and devices.

Terminal Pitch: 1.27 mm

Optimal terminal spacing for easy connections and integration within electronic systems.

Driver No. of Bits: 2

Efficient for driving signals and communicating data in binary form, supporting digital communication protocols.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for transmitting and receiving data signals over communication lines, ensuring reliable data exchange.

Technical Specifications

Line Drivers & Receivers TRSF3223IDWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TRSF3223IDWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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