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TRSF3223ECPW

Texas Instruments

TRSF3223ECPW by Texas Instruments

TRSF3223ECPW by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.6V max supply voltage. It features EIA-232-F interface standard and Schmitt trigger input characteristics, suitable for commercial temperature grade applications requiring thin profile packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 3,501 parts In-Stock

1+ parts

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Vyrian

USA . 2,440 parts In-Stock

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2,440

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Digiode

USA . 1,782 parts In-Stock

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1,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 816 parts In-Stock

1+ parts

$2.500

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816

$2.500

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Parana Technologies

USA . 1,793 parts In-Stock

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$3.958

100+ parts

$367.545

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$3.562

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1,793

$3.958

$367.545

$3.562

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DigiPath Technology Company

USA . 1,545 parts In-Stock

1+ parts

$4.358

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$4.009

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$4.358

$4.009

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ChromeModa Solutions

Germany . 1,236 parts In-Stock

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$4.447

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$3.647

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$4.447

$3.647

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IDEA Electronic Components Group

UK . 787 parts In-Stock

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$4.447

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$4.002

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787

$4.447

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$4.002

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AZTECH Wire

Italy . 442 parts In-Stock

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$12.155

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QUARKTWIN TECHNOLOGY LTD

USA . 21,067 parts In-Stock

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Corphita

USA . 4,769 parts In-Stock

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Microchip USA

USA . 2,808 parts In-Stock

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Overview

Enhance your electronic design with the TRSF3223ECPW by Texas Instruments, a top-quality line driver & receiver that guarantees seamless communication in various applications. With Texas Instruments' unparalleled expertise in manufacturing, this product offers unmatched reliability and performance. Ideal for industrial automation, telecommunications, and consumer electronics, this compact and powerful device operates at a wide voltage range while consuming minimal power. Trust Texas Instruments to deliver innovative solutions that exceed expectations. Upgrade your projects today with the TRSF3223ECPW and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Surface Mount: YES

Easily mounted onto circuit boards for convenient installation.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages without risk of damage, ensuring reliable operation.

No. of Functions: 2

Provides multiple functions in a single unit, saving space and cost.

Package Shape: RECTANGULAR

Standard shape that fits well in most circuit designs.

Power Supplies (V): 3.3/5

Compatible with common power supply voltages, versatile for various applications.

No. of Terminals: 20

Offers multiple connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design that saves space on PCB while maintaining high performance.

Maximum High Level Input Current: 0.000001 Amp

Efficient power consumption for energy-efficient operation.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, suitable for low-power applications.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-term reliability.

Terminal Position: DUAL

Allows for versatile mounting orientations for flexible PCB layouts.

Maximum Seated Height: 1.2 mm

Low-profile design for compact electronic devices.

Width: 4.4 mm

Narrow width for space-saving installation on PCB.

Maximum Output Low Current: 1.6 Amp

Provides strong output current for driving external loads.

Receiver No. of Bits: 2

Dual-bit receiver for accurate data reception.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow process for efficient manufacturing.

Peak Reflow Temperature °C: 260

High-temperature reflow capability for lead-free soldering.

Length: 6.5 mm

Compact length for space-constrained PCB designs.

Minimum Out Swing: 10 V

Wide voltage swing for robust signal transmission.

Temperature Grade: COMMERCIAL

Suitable for commercial-grade applications.

Maximum Receive Delay: 0 ns

Instantaneous signal reception for real-time data processing.

Terminal Form: GULL WING

Secure terminal form for reliable solder connections.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry standards for interoperability.

Maximum Supply Current: 1 mA

Low power consumption for energy-efficient operation.

Input Characteristics: SCHMITT TRIGGER

Provides noise immunity and signal conditioning for reliable input processing.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

Terminal Pitch: 0.65 mm

Fine pitch for high-density PCB layouts.

Driver No. of Bits: 2

Dual-bit driver for accurate signal transmission.

Interface IC Type: LINE TRANSCEIVER

Transmits and receives data signals efficiently for seamless communication.

Technical Specifications

Line Drivers & Receivers TRSF3223ECPW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TRSF3223ECPW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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