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TRSF3223ECDBG4

Texas Instruments

TRSF3223ECDBG4 by Texas Instruments

TRSF3223ECDBG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features Schmitt Trigger input characteristics and supports EIA-232-F, TIA-232-F, V.28 interface standards. Ideal for commercial applications requiring reliable data transmission in a compact package style with dual terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,415

-

-

-

-

Digiode

USA . 3,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,775

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,267 parts In-Stock

1+ parts

$6.764

100+ parts

-

1k+ parts

$7.428

10k+ parts

-

2,267

$6.764

-

$7.428

-

DigiPath Technology Company

USA . 1,173 parts In-Stock

1+ parts

$7.448

100+ parts

$6.852

1k+ parts

-

10k+ parts

-

1,173

$7.448

$6.852

-

-

IDEA Electronic Components Group

UK . 1,164 parts In-Stock

1+ parts

$7.600

100+ parts

-

1k+ parts

$6.840

10k+ parts

-

1,164

$7.600

-

$6.840

-

ChromeModa Solutions

Germany . 1,073 parts In-Stock

1+ parts

$7.600

100+ parts

$6.232

1k+ parts

-

10k+ parts

-

1,073

$7.600

$6.232

-

-

AZTECH Wire

Italy . 855 parts In-Stock

1+ parts

$15.569

100+ parts

-

1k+ parts

-

10k+ parts

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855

$15.569

-

-

-

One Stop Electronics

USA . 1,307 parts In-Stock

1+ parts

$48.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,307

$48.500

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-

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Component Stockers USA

USA . 346 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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346

$99.990

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-

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Corphita

USA . 2,728 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,728

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Microchip USA

USA . 393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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393

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Overview

Elevate your communication systems with the TRSF3223ECDBG4 by Texas Instruments, a top-of-the-line line driver and receiver designed for optimal performance and reliability. With Texas Instruments' renowned reputation for quality and innovation, this product delivers seamless connectivity and precision in a compact package. Ideal for a wide range of applications, this device offers customers unparalleled value, benefits, and advantages in their projects. Upgrade your electronics with the TRSF3223ECDBG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product is compatible with a wide range of power sources, offering flexibility in design.

No. of Functions: 2

Having 2 functions in one package makes this product cost-effective and space-efficient, ideal for applications requiring multiple functions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit layouts, enabling seamless connectivity.

Power Supplies (V): 3.3/5

Supporting multiple power supply options of 3.3V and 5V, this product can be used in a variety of voltage environments, enhancing its versatility.

No. of Terminals: 20

With 20 terminals, this product offers ample connection points for interfacing with other components, making it suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style reduces the footprint on the PCB, allowing for high-density mounting and improved board space utilization.

Maximum High Level Input Current: 0.000001 Amp

The low input current requirement ensures efficient power consumption, making this product energy-efficient and ideal for battery-powered devices.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, this product can operate reliably in low voltage conditions, expanding its range of applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the product to function in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures reliable connections and prevents corrosion, extending the product's lifespan.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout and allows for various connection configurations, enhancing design options.

Maximum Seated Height: 2 mm

The low seated height of 2mm enables the product to be used in compact designs where space is limited, offering versatility in layout options.

Width: 5.3 mm

The narrow width of 5.3mm allows for efficient use of board space and makes the product suitable for applications with size constraints.

Maximum Output Low Current: 1.6 Amp

The high output low current capability of 1.6A ensures reliable performance in driving loads, making this product suitable for power-demanding applications.

Receiver No. of Bits: 2

With 2 bits, the receiver provides accurate data reception and processing, making it suitable for applications requiring precise signal handling.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature of 30s ensures quick and efficient soldering during assembly, reducing production time.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for soldering using standard reflow processes, ensuring reliable and durable connections.

Length: 7.2 mm

The compact length of 7.2mm enables easy integration into tight spaces and compact designs, making the product versatile and suitable for various applications.

Minimum Out Swing: 10 V

The minimum output swing of 10V ensures accurate signal transmission with minimal distortion, making this product ideal for high-fidelity applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is suitable for standard operating conditions in commercial applications, offering reliability and consistent performance.

Maximum Receive Delay: 0 ns

The zero receive delay ensures real-time data reception and processing, making this product suitable for applications requiring instantaneous response.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and mechanical stability, ensuring reliable performance in demanding environments.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with interface standards EIA-232-F, TIA-232-F, and V.28 ensures compatibility with a wide range of systems and devices, making this product versatile and interoperable.

Maximum Supply Current: 1 mA

The low maximum supply current of 1mA minimizes power consumption, making this product efficient and economical for energy-sensitive applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics ensure robust signal processing and noise immunity, enhancing the reliability and performance of the product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable and consistent power to the product, ensuring reliable operation in various voltage conditions.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting and precise soldering, enhancing the product's suitability for compact designs and miniaturized applications.

Driver No. of Bits: 2

With 2 bits, the driver provides accurate signal transmission and control, making it suitable for applications requiring precise output.

Interface IC Type: LINE TRANSCEIVER

The integration of a line transceiver IC type ensures efficient signal conversion and communication between different interface standards, making this product versatile and compatible with various systems.

Technical Specifications

Line Drivers & Receivers TRSF3223ECDBG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TRSF3223ECDBG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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