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TRSF3223CDBR

Texas Instruments

TRSF3223CDBR by Texas Instruments

TRSF3223CDBR by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and Gull Wing terminal form. Ideal for commercial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,399 parts In-Stock

1+ parts

-

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4,399

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Digiode

USA . 2,982 parts In-Stock

1+ parts

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2,982

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

1+ parts

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2,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

$8.460

100+ parts

$785.671

1k+ parts

$7.614

10k+ parts

-

1,829

$8.460

$785.671

$7.614

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DigiPath Technology Company

USA . 2,115 parts In-Stock

1+ parts

$9.316

100+ parts

$8.571

1k+ parts

-

10k+ parts

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2,115

$9.316

$8.571

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ChromeModa Solutions

Germany . 1,328 parts In-Stock

1+ parts

$9.506

100+ parts

$7.795

1k+ parts

-

10k+ parts

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1,328

$9.506

$7.795

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IDEA Electronic Components Group

UK . 191 parts In-Stock

1+ parts

$9.506

100+ parts

$9.031

1k+ parts

$8.555

10k+ parts

-

191

$9.506

$9.031

$8.555

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AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$16.969

100+ parts

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336

$16.969

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One Stop Electronics

USA . 533 parts In-Stock

1+ parts

$45.500

100+ parts

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533

$45.500

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Authorized Procurement Solutions

USA . 23,800 parts In-Stock

1+ parts

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23,800

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Lixinc

USA . 15,089 parts In-Stock

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15,089

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A-Z Elektronik GmbH

Germany . 7,137 parts In-Stock

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7,137

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,281 parts In-Stock

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1,281

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Microchip USA

USA . 421 parts In-Stock

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421

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Overview

Experience seamless communication with the TRSF3223CDBR by Texas Instruments. Crafted with precision and quality, this line driver and receiver offers reliability and performance like no other. Perfect for a wide range of applications, this product ensures smooth data transmission with its advanced features. Trust in Texas Instruments to deliver superior products that provide value and benefits to customers, making every interaction effortless and efficient. Elevate your communication systems with the TRSF3223CDBR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and reliability to the product.

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs for flexibility in use.

No. of Functions: 2

Can perform multiple functions efficiently in one package.

Package Shape: RECTANGULAR

Standard shape for easy integration into circuit designs.

Power Supplies (V): 3.3/5

Compatible with common power supply voltages for convenience.

No. of Terminals: 20

Provides multiple connections for interfacing with other components.

Maximum High Level Input Current: 0.000001 Amp

Efficiently handles high-level input currents with minimal power consumption.

Minimum Supply Voltage: 3 V

Works reliably even at low voltage inputs.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperatures for versatility in applications.

Minimum Operating Temperature: 0 °C

Can start functioning at low temperatures without issues.

Terminal Position: DUAL

Dual terminal position for better connectivity and stability.

Maximum Seated Height: 2 mm

Low-profile design for compact and space-saving installations.

Width: 5.3 mm

Narrow width for fitting in tight spaces on the PCB.

Maximum Output Low Current: 1.6 Amp

Capable of delivering high output current for driving external components.

Receiver No. of Bits: 2

Suitable for receiving and processing digital data in 2-bit format.

Length: 7.2 mm

Optimal length for placement on the PCB.

Minimum Out Swing: 10 V

Supports a wide output swing for compatibility with various signal levels.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial use.

Maximum Receive Delay: 0 ns

Delivers high-speed response time for instant data reception.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and robust connections.

Interface Standard: EIA-232

Complies with the EIA-232 interface standard for reliable communication.

Maximum Supply Current: 1 mA

Low supply current for energy-efficient operation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input for noise immunity and signal stability.

Nominal Supply Voltage: 3.3 V

Nominal voltage rating for consistent performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and high-density PCB layouts.

Driver No. of Bits: 2

2-bit driver for delivering digital signals accurately.

Interface IC Type: LINE TRANSCEIVER

Line transceiver IC type for converting and transmitting signals effectively.

Technical Specifications

Line Drivers & Receivers TRSF3223CDBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3223CDBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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