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TRSF3223CDBG4

Texas Instruments

TRSF3223CDBG4 by Texas Instruments

TRSF3223CDBG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and dual terminal position. Ideal for commercial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,907 parts In-Stock

1+ parts

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7,907

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Digiode

USA . 859 parts In-Stock

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859

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 653 parts In-Stock

1+ parts

$5.500

100+ parts

-

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653

$5.500

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Parana Technologies

USA . 1,473 parts In-Stock

1+ parts

$9.137

100+ parts

-

1k+ parts

$9.787

10k+ parts

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1,473

$9.137

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$9.787

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DigiPath Technology Company

USA . 1,114 parts In-Stock

1+ parts

$10.061

100+ parts

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1,114

$10.061

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ChromeModa Solutions

Germany . 4,431 parts In-Stock

1+ parts

$10.266

100+ parts

$8.418

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4,431

$10.266

$8.418

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IDEA Electronic Components Group

UK . 534 parts In-Stock

1+ parts

$10.266

100+ parts

$9.753

1k+ parts

$9.239

10k+ parts

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534

$10.266

$9.753

$9.239

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AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$19.387

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596

$19.387

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Corphita

USA . 377 parts In-Stock

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377

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Microchip USA

USA . 131 parts In-Stock

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131

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Overview

Discover the TRSF3223CDBG4 by Texas Instruments, a top-quality line driver and receiver designed to meet your connectivity needs. With a reputation for excellence, Texas Instruments delivers a reliable product that boasts 2 functions in a compact package. Ideal for applications requiring precision and efficiency, this product operates at a wide range of temperatures and voltages. Experience seamless communication with the TRSF3223CDBG4 and unlock the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatile use in various electronic applications.

No. of Functions: 2

Having 2 functions in one product provides added functionality and versatility.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies for flexible integration into different systems.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy placement and mounting on circuit boards.

Maximum High Level Input Current: 0.000001 Amp

Low input current helps in reducing power consumption and heat generation.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with various power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows for reliable performance in different environments.

Minimum Operating Temperature: 0 °C

The product can operate effectively even in low-temperature conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in connectivity and installation.

Maximum Seated Height: 2 mm

Low seated height enables compact design and space-saving installation.

Width: 5.3 mm

Narrow width makes the product suitable for applications with space constraints.

Maximum Output Low Current: 1.6 Amp

High output current capability allows for driving loads with significant power requirements.

Receiver No. of Bits: 2

2-bit receiver provides accurate and reliable data reception.

Length: 7.2 mm

Compact length facilitates easy integration into electronic systems.

Minimum Out Swing: 10 V

Wide output swing ensures compatibility with various input voltage levels.

Temperature Grade: COMMERCIAL

Commercial-grade temperature rating ensures reliable performance in standard operating conditions.

Maximum Receive Delay: 0 ns

Negligible receive delay ensures real-time data transmission.

Terminal Form: GULL WING

Gull wing terminal form enables secure solder connections on circuit boards.

Interface Standard: EIA-232

Complies with industry-standard interface for seamless compatibility with other devices.

Maximum Supply Current: 1 mA

Low supply current requirement helps in reducing overall power consumption.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics ensure reliable signal processing and noise immunity.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance in electronic systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on PCBs.

Driver No. of Bits: 2

2-bit driver for accurate and efficient signal transmission.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type ensures seamless communication between different devices.

Technical Specifications

Line Drivers & Receivers TRSF3223CDBG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3223CDBG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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