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TRSF3222IPWRG4

Texas Instruments

TRSF3222IPWRG4 by Texas Instruments

TRSF3222IPWRG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and industrial temperature grade. Ideal for applications requiring high-speed data transmission in harsh environments due to its small outline package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,677 parts In-Stock

1+ parts

-

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8,677

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Digiode

USA . 4,859 parts In-Stock

1+ parts

-

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4,859

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 351 parts In-Stock

1+ parts

$7.273

100+ parts

-

1k+ parts

$7.774

10k+ parts

-

351

$7.273

-

$7.774

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ChromeModa Solutions

Germany . 6,325 parts In-Stock

1+ parts

$8.172

100+ parts

$6.701

1k+ parts

-

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6,325

$8.172

$6.701

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IDEA Electronic Components Group

UK . 304 parts In-Stock

1+ parts

$8.172

100+ parts

-

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$7.355

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304

$8.172

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$7.355

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AZTECH Wire

Italy . 467 parts In-Stock

1+ parts

$14.695

100+ parts

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467

$14.695

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One Stop Electronics

USA . 914 parts In-Stock

1+ parts

$29.500

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914

$29.500

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QUARKTWIN TECHNOLOGY LTD

USA . 26,080 parts In-Stock

1+ parts

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26,080

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Corphita

USA . 3,130 parts In-Stock

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3,130

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DigiPath Technology Company

USA . 1,346 parts In-Stock

1+ parts

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100+ parts

$7.368

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1,346

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$7.368

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Microchip USA

USA . 173 parts In-Stock

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173

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Overview

Enhance your electronic projects with the TRSF3222IPWRG4 from Texas Instruments, a top-quality line driver & receiver that offers unparalleled reliability and performance. Made by a trusted manufacturer, this product is designed to meet the demands of industrial applications with ease. With its compact design and wide operating temperature range, this device provides exceptional value for customers seeking efficient communication solutions. Whether you're working on automation systems or data communication networks, the TRSF3222IPWRG4 delivers the benefits and advantages you need to take your projects to the next level. Trust Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle a wide range of power inputs, ensuring compatibility with various systems.

No. of Functions: 2

Having multiple functions in one product increases versatility and functionality, making it a cost-effective solution for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package saves space on the PCB, making it suitable for applications with limited board real estate.

Maximum Output Low Current: 1.6 Amp

The high maximum output low current capability ensures reliable signal transmission without the risk of overload or damage.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common industry standard, ensuring compatibility with a wide range of systems and devices.

Technical Specifications

Line Drivers & Receivers TRSF3222IPWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRSF3222IPWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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