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TRSF3222IPW

Texas Instruments

TRSF3222IPW by Texas Instruments

TRSF3222IPW by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 20 terminals, and EIA-232 interface standard. It operates in industrial temperature range (-40 to 85 °C) and has dual terminal position for versatile applications. Ideal for data communication systems requiring high-speed transmission with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,944

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-

-

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Digiode

USA . 2,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,850

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,568 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,568

$5.500

-

-

-

Parana Technologies

USA . 2,013 parts In-Stock

1+ parts

$6.819

100+ parts

-

1k+ parts

$7.459

10k+ parts

-

2,013

$6.819

-

$7.459

-

DigiPath Technology Company

USA . 1,858 parts In-Stock

1+ parts

$7.509

100+ parts

-

1k+ parts

-

10k+ parts

-

1,858

$7.509

-

-

-

ChromeModa Solutions

Germany . 1,315 parts In-Stock

1+ parts

$7.662

100+ parts

$6.283

1k+ parts

-

10k+ parts

-

1,315

$7.662

$6.283

-

-

IDEA Electronic Components Group

UK . 945 parts In-Stock

1+ parts

$7.662

100+ parts

-

1k+ parts

$6.896

10k+ parts

-

945

$7.662

-

$6.896

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AZTECH Wire

Italy . 881 parts In-Stock

1+ parts

$10.223

100+ parts

-

1k+ parts

-

10k+ parts

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881

$10.223

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Corphita

USA . 4,643 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,643

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Microchip USA

USA . 168 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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168

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Overview

Unlock the potential of your electronic systems with the TRSF3222IPW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The TRSF3222IPW falls under the Line Drivers & Receivers category, offering seamless integration and efficient communication. With a compact design and multiple functions, this product provides value and benefits that cater to a wide range of applications. Elevate your projects with the TRSF3222IPW and experience unparalleled performance and versatility like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line drivers & receivers, ensuring a longer lifespan for the product.

Surface Mount: YES

This feature makes it easy to integrate the line drivers & receivers onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

No. of Functions: 2

Having multiple functions in a single device can reduce the overall component count in a system, leading to cost savings and simplifying designs.

Package Shape: RECTANGULAR

The rectangular shape is a common and convenient form factor for easy integration into various electronic systems and setups.

Power Supplies (V): 3.3/5

With support for multiple power supply voltages, this product can be adaptable to different system requirements and configurations.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connectivity options and compatibility with different circuit layouts.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style enables space-saving designs and facilitates high-density mounting on PCBs.

Maximum High Level Input Current: 0.000001 Amp

This low input current requirement helps in minimizing power consumption and reducing heat generation in the device.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for operation in systems with lower power supply capabilities, enhancing versatility.

Maximum Operating Temperature: 85 °C

The wide operating temperature range ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can tolerate cold environments without compromising its functionality.

Terminal Position: DUAL

The dual terminal position offers flexibility in the orientation of the device during installation, making it easier to integrate into different setups.

Maximum Seated Height: 1.2 mm

The low profile design with a maximum seated height of 1.2 mm allows for compact integration in space-constrained applications.

Width: 4.4 mm

The narrow width of 4.4 mm enables efficient use of PCB real estate, especially in designs where space is a critical factor.

Maximum Output Low Current: 1.6 Amp

The high maximum output low current capability indicates strong driving capability for connected devices, ensuring reliable signal transmission.

Receiver No. of Bits: 2

The 2-bit receiver configuration allows for enhanced data transmission capabilities, providing more options for signal processing and communication.

Length: 6.5 mm

The compact length of 6.5 mm contributes to the overall small form factor of the product, making it suitable for space-constrained applications.

Minimum Out Swing: 10 V

The minimum output swing of 10 V ensures compatibility with a wide range of devices and signal levels, enhancing the versatility of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that this product is designed to operate reliably in harsh industrial environments with varying temperature conditions.

Maximum Receive Delay: 0 ns

The zero receive delay ensures quick response times for incoming signals, reducing latency and improving overall system performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable electrical connections during installation, ensuring robust connectivity.

Interface Standard: EIA-232

This interface standard compatibility ensures seamless integration with other EIA-232 compliant devices, enabling easy interoperability in communication networks.

Maximum Supply Current: 1 mA

The low maximum supply current requirement helps in conserving power and prolonging battery life in portable or energy-efficient applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide hysteresis and noise immunity, ensuring reliable signal processing and reducing errors in data transmission.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common and widely supported standard, making this product compatible with a wide range of systems and applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on PCBs, maximizing space utilization and enabling compact designs.

Driver No. of Bits: 2

The 2-bit driver configuration provides enhanced signal driving capabilities, allowing for reliable transmission of data over long distances and through complex networks.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional communication and signal conversion between different line protocols, enhancing compatibility and interoperability.

Technical Specifications

Line Drivers & Receivers TRSF3222IPW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRSF3222IPW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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